Crystalline silicon single-knife guillotine

Abstract

The invention relates to a crystalline silicon single-knife guillotine, and belongs to the technical field of crystalline silicon processing equipment. The crystalline silicon single-knife guillotineincludes a base, a conveying mechanism and a cutting mechanism, wherein the conveying mechanism and the cutting mechanism are located above the base; the conveying mechanism is divided into two levelsin the axial direction of the crystalline silicon, the two levels are the feeding conveying assembly and the discharging conveying assembly respectively, a moving supporting mechanism is arranged between the feeding conveying assembly and the discharging conveying assembly, and the cutting mechanism is arranged above the moving supporting mechanism in a cross mode; and a clamping claw assembly isarranged on the discharging conveying assembly. According to the crystalline silicon single-knife guillotine, the conveying mechanism is combined with the moving supporting mechanism so as to fix thecrystalline silicon with different cutting lengths, and the flexibility is high; and meanwhile, the integration of winding, rewinding and cutting functions is achieved, the structure is compact, theequipment manufacturing cost is reduced, the crystalline silicon single-knife guillotine is also adapt to factory layout needs, the structure is compact, the economy and durability are achieved, and the application prospects are wide.

Description

technical field [0001] The invention belongs to the technical field of crystal silicon processing equipment, in particular to a crystal silicon single-knife cutting machine. Background technique [0002] The manufacturing process of silicon wafers used in making solar panels is divided into several steps: crystal pulling, truncation, squaring, grinding, and slicing. At present, the wire cutting technology is a relatively advanced crystal silicon cutting processing technology. Its principle is to rub the crystal silicon through a high-speed moving cutting wire to achieve the purpose of cutting. [0003] The multi-knife cutting machine is the most widely used. It uses the guide wheel to arrange the cutting wire into a net shape, and can complete the multi-knife cutting of crystal silicon through one-time operation from top to bottom. With the improvement of the crystal pulling process, the length of the silicon rods smelted by the crystal pulling furnace is lengthened, but th...

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Problems solved by technology

With the improvement of the crystal pulling process, the length of the silicon rods smelted by the crystal pulling furnace is lengthened, but the applicable rod length range of the multi-knife cutting machine on the market has not reached the new rod length. At the same time, a large number of crystal silicon factories are under construction. At that time, it did not consider that there would be a breakthrough in the silicon ingot pulling process, and it was developing towards longer and longer lengths, which made it difficult to transfer silicon ingots in the factory.

In addition, for small and medium-sized enterprises, in order to ensure the continuity of operations and production capacity, two sets of equipment are generally arranged to operate continuously and alternately, and there is a phenomenon of overcapacity

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