48results about How to "Avoid cutting errors" patented technology

The invention relates to a crystalline silicon single-knife guillotine, and belongs to the technical field of crystalline silicon processing equipment. The crystalline silicon single-knife guillotineincludes a base, a conveying mechanism and a cutting mechanism, wherein the conveying mechanism and the cutting mechanism are located above the base; the conveying mechanism is divided into two levelsin the axial direction of the crystalline silicon, the two levels are the feeding conveying assembly and the discharging conveying assembly respectively, a moving supporting mechanism is arranged between the feeding conveying assembly and the discharging conveying assembly, and the cutting mechanism is arranged above the moving supporting mechanism in a cross mode; and a clamping claw assembly isarranged on the discharging conveying assembly. According to the crystalline silicon single-knife guillotine, the conveying mechanism is combined with the moving supporting mechanism so as to fix thecrystalline silicon with different cutting lengths, and the flexibility is high; and meanwhile, the integration of winding, rewinding and cutting functions is achieved, the structure is compact, theequipment manufacturing cost is reduced, the crystalline silicon single-knife guillotine is also adapt to factory layout needs, the structure is compact, the economy and durability are achieved, and the application prospects are wide.

The invention relates to notch sample preparation equipment and a notch sample preparation method. The notch sample preparation equipment comprises a clamping device, a cutting moving device, a cutting knife, a control device and a measuring device. The clamping device is used for clamping and fixing a pipe. The cutting knife is used for cutting the pipe. The cutting moving device is connected with the cutting knife and used for driving the cutting knife to move. The measuring device is mounted on the cutting moving device and used for acquiring position parameters and structure parameters ofthe pipe. The control device is electrically connected with the measuring device and the cutting moving device and used for generating a cutting process according to the preset cutting depth and cutting length and in combination with the position parameters and the structure parameters, and meanwhile controlling the cutting moving device according to the cutting process in order to enable the cutting moving device to drive the cutting knife to cut the pipe. Thus, full-automatic notch sample preparation of the pipe is achieved, cutting errors caused by manual operation are avoided, and the precision and stability of notch sample preparation of the pipe are improved.

The invention relates to a wafer stage encapsulation LED (light emitting diode), and relates to LED encapsulation. The wafer stage encapsulation LED is provided with an LED chip, a lens and a lens bonding layer, wherein the LED chip is provided with a substrate layer, a doping semiconductor layer, a semiconductor luminous layer, a conducting reflecting layer, an electrode, an insulation layer and a coating medium, wherein the semiconductor luminous layer is arranged between the first doping semiconductor layer and the second doping semiconductor layer; the conducting reflecting layer is arranged under the second doping semiconductor layer; the second electrode realizes the electric conduction with the second doping semiconductor layer through the conducting reflecting layer; the first electrode and the first doping semiconductor layer are directly connected; the insulation among the first electrode, the semiconductor luminous layer, the second doping semiconductor layer and the conducting reflection layer is realized by an insulation layer; the coating medium is arranged on a non-substrate region of the side wall of the LED chip; a through hole is formed inside the substrate layer; the inner wall of the through hole is provided with a high-reflectivity layer; the lens comprises a flat plate part and an optical coupling part; the flat plate part is fixed onto the substrate layer; the optical coupling part is arranged in the through hole of the substrate layer; in addition, the optical receiving surface of the optical coupling part faces the first doping semiconductor layer.

The invention relates to the technical field of LED lamps and discloses a fixed-length cutting and dust removing device for LED lamp manufacturing. The device comprises a first shell, an electric telescopic rod is fixedly connected into the first shell, a cutting head is fixedly connected to the outside of the electric telescopic rod, a screw rod is movably connected into the first shell, and a sliding block is movably connected to the outside of the screw rod. Under the interaction of a second shell, sliding rods, iron blocks, retaining springs, electromagnets, a control gear, a water outlet pipe and a water inlet pipe, when a cutting machine cuts an LED lamp, the device can automatically remove dust, in this way, chippings generated after cutting can be prevented from flying into the air, accordingly, the flying chippings can be prevented from being sucked into the body of people, thus, the physical health of the people can be protected, in addition, the chippings are removed in the cutting process, the situation that the chippings generated after cutting jam parts in the cutting machine can be avoided, and therefore, the service life of the cutting machine can be prolonged.

The invention discloses an excess material removal technology for an alloy die casting piece. The excess material removal technology comprises the following steps that a to-be-machined workpiece is fixed to an electromagnet clamp, and the to-be-machined workpiece is adjusted to the preset position of a workbench; and laser cutting equipment is used for conducting laser cutting treatment on rough edges and a hole-shaped structure of the treated workpiece, rough materials on the periphery of the to-be-machined workpiece and excess materials in the hole-shaped structure are removed, and pre-machining is conducted on the to-be-machined workpiece. The to-be-machined workpiece is fixed through the electromagnet clamp, then the laser cutting equipment is used for conducting laser cutting treatment on the rough edges and the hole-shaped structure of the treated workpiece, the rough materials on the periphery of the to-be-machined workpiece and the excess materials in the hole-shaped structureare removed, then rapid cutting of the excess materials of the alloy die casting piece can be achieved, and accordingly the alloy die casting piece excess material removal efficiency is improved; andmeanwhile, the electromagnet clamp can rapidly and effectively fix the workpiece, product fixing through a complex die structure is not needed, and the workpiece installing efficiency is improved.

The invention discloses a five-axis spherical laser cutting device. The five-axis spherical laser cutting device comprises a cutting platform, first longitudinal moving devices are arranged on the two sides of the cutting platform, a lifting cross beam is arranged between the two first longitudinal moving devices, a balance weight device is arranged on one side face of the lifting cross beam, and a transverse moving device is arranged on the other side face of the lifting cross beam; and a second longitudinal moving device is arranged on one side face of the transverse moving device, a telescopic arm is arranged on the lower end face of the second longitudinal moving device, a rotating device is arranged on the lower end face of the telescopic arm, a laser cutter is arranged on one side face of the rotating device, and a control module is arranged on one side face of the first longitudinal moving device. According to the device, five-axis freedom degrees can be formed, slope cutting is facilitated, the cutting precision can be improved, cutting errors are avoided, and the device production cost is reduced.

The invention discloses efficient mechanical type automation cutting equipment which comprises a bottom plate device, a supporting plate device, a bracket device, a transverse plate device, an electric cylinder device, a cutting knife device, a pushing device and a locating device; a bottom plate and universal wheels are arranged on the bottom plate device; the supporting plate device comprises a supporting plate, first supporting rods, second supporting rods and first fixing rods; the bracket device comprises a first bracket, a connecting plate and a second fixing rod; the transverse plate device comprises a first transverse plate, second brackets, first transverse rods and third fixing rods; the electric cylinder device comprises an electric cylinder, a pushing rod, a movable frame and a locating frame; the cutting knife device comprises a fixing plate, a cutting knife and a fixing bracket; the pushing device comprises a first vertical rod, a first spring, a second vertical rod and a pushing wheel; and the locating device comprises a third vertical rod, a limiting block, a locating rod and a second spring located on the locating rod. The efficient mechanical type automation cutting equipment can cut a pipeline effectively, and is high in cutting efficiency and low in manual labor intensity.

The invention discloses a high-speed vegetable cutter, which comprises a rack, wherein a feeding device, a longitudinal cutting device and a transverse cutting device are arranged on the rack. The high-speed vegetable cutter is simple in structure, high in automation degree, cutting accuracy and speed, free of manual intervention and low in manpower consumption and labor cost; vegetables can be cut into small sections with required lengths only by being placed on a conveying belt and fed into the longitudinal cutting device and the transverse cutting device, and the fed vegetables can be cut into sections without placement or arrangement, so that the working efficiency is further improved, and the working adaptability is also enhanced.

The invention relates to a tube drawing bench with a feeding device. The tube drawing bench comprises a bench body, a bench head, the feeding device, a trolley and a chain. The chain is installed at the top of the bench body. The trolley is installed between two side plates, at the two sides of the chain, of the bench body in a sliding mode. A clamp is installed on the trolley. The bench head is installed on one side of the bench body. The feeding device is installed in the bench head, and comprises an installation frame, a pushing mechanism, a pushing plate and a straightening plate. The installation frame is a rectangular frame. Two plain shafts are fixedly arranged between a left side plate and a right side plate of the installation frame in a vertically-symmetric mode. The pushing mechanism, the pushing plate and the straightening plate are sequentially installed between the two plain shafts at intervals in a sliding mode. Feeding holes are coaxially formed in the centers of the pushing plate, the straightening plate and the left side plate and the right side plate of the installation frame. An annular tool is coaxially installed in the feeding hole of the right side plate of the installation frame. The tube drawing bench is used for ejecting the heads of bars out of the annular tool through the pushing mechanism, so that the heads of the bars are clamped by the clamp of the trolley; the drawing-down procedure of the heads of the bars is omitted, labor is saved, and the working efficiency is improved.

The invention discloses a processing device for a semiconductor graphite wafer and a processing method of the processing device for the semiconductor graphite wafer. The processing device for the semiconductor graphite wafer comprises a base. The top surface of each first T-shaped sliding block is fixedly connected to the bottom surface of a moving plate. An adjusting assembly is arranged on the edge of one side of the top surface of the moving plate, a rotating assembly is arranged in the middle of the top surface of the moving plate, and a workbench is fixedly connected with the top of a fixing shaft in the rotating assembly. A clamping groove is formed in the middle of the top surface of the workbench, and a negative pressure groove is axially formed in the middle of the top surface ofthe clamping groove. A cutting assembly is fixedly connected to the middle of the top of a supporting plate, a water guide pipe penetrates through one side of a cutter cover in the cutting assembly, one end of a water outlet pipe is arranged in the middle of the water guide pipe, and the other end of the water outlet pipe is located on one side face of a cutter. According to the processing devicefor the semiconductor graphite wafer, the workbench can be moved forwards and backwards through an adjusting device, the workbench can be rotated through a rotating device, and therefore the wafer canbe cut in different directions, the working efficiency is improved, and the cutting error is avoided. Meanwhile, the cutter can ascend and descend, and therefore the wafer is conveniently cut.