Modified polystyrene board, and preparation method and application thereof

A polystyrene board and modification technology, which is applied in the field of preparation and modification of polystyrene board, can solve the problems of potential safety hazards, the inability to recycle waste materials, and the inability to re-foam, etc., to achieve high strength and thermal insulation performance, reduce cost, to achieve the effect of environmental friendliness of the process

Active Publication Date: 2018-12-07
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the prior art, water vapor is used for pressure molding in the molding process of the preparation method of polystyrene board, which has potential safety hazards
In addition, polystyrene particles cannot be foamed again after secondary foaming, and waste materials cannot be reused. How to develop a method for preparing polystyrene boards that can use waste materials is a difficult problem in this field

Method used

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  • Modified polystyrene board, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] A modified polystyrene board is prepared by the following method:

[0053] (1) Below 30°C, mix 100 parts by weight of thermosetting phenolic resin, 10 parts by weight of flame retardant decabromodiphenyl ether, foaming agent methylene chloride accounting for 8 wt% of thermosetting resin, and surfactant accounting for 2 wt% of thermosetting resin Polyoxyethylene sorbitan monooleate, dispersant glyceryl tristearate accounting for 2wt% of polystyrene foamed particles to obtain binder;

[0054] (2) 100 parts by weight of pulverized particles of polystyrene plate waste in the range of 2 to 15 mm in particle size and binder are mixed uniformly to obtain molding material;

[0055] (3) Add 11wt% curing agent of thermosetting resin to the molding material and mix, then pressurize and mold for 15 minutes under the conditions of pressure 0.8-1.2MPa and temperature 100°C to 15% of the original bulk volume, and the improved durable polystyrene board.

Embodiment 2

[0057] A modified polystyrene board is prepared by the following method:

[0058] (1) Below 30°C, mix 40 parts by weight of thermosetting phenolic resin, 1 part by weight of flame retardant decabromodiphenyl ether, foaming agent dichloromethane accounting for 6 wt% of thermosetting resin, and surfactant accounting for 5 wt% of thermosetting resin Polyoxyethylene sorbitan monooleate, glyceryl tristearate accounting for 5wt% of polystyrene foamed particles to obtain a binder;

[0059] (2) 100 parts by weight of pulverized particles of polystyrene plate waste in the range of 2 to 15 mm in particle size and binder are mixed uniformly to obtain molding material;

[0060] (3) Add 8wt% curing agent of thermosetting resin to the molding material and mix it, and then perform mechanical press molding for 5 minutes at a pressure of 0.2-0.5MPa and a temperature of 60-100°C to 20% of the original bulk volume, A modified polystyrene board was obtained.

Embodiment 3

[0062] A modified polystyrene board is prepared by the following method:

[0063] (1) Below 30°C, mix 160 parts by weight of thermosetting phenolic resin, 20 parts by weight of flame retardant decabromodiphenyl ether, foaming agent dichloromethane accounting for 12 wt% of thermosetting resin, and surfactant accounting for 1 wt% of thermosetting resin Polyoxyethylene sorbitan monooleate, glyceryl tristearate accounting for 1 wt% of polystyrene foamed particles to obtain a binding material;

[0064] (2) 100 parts by weight of pulverized particles of polystyrene plate waste in the range of 2 to 15 mm in particle size and binder are mixed uniformly to obtain molding material;

[0065] (3) Add 15wt% curing agent of thermosetting resin to the molding material and mix it, then press and mold it mechanically for 20 minutes at a pressure of 1.2-1.5MPa and a temperature of 110-120°C until it reaches 2% of the original bulk volume, A modified polystyrene board was obtained.

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Abstract

The invention relates to a preparation method of a modified polystyrene board. The preparation method comprises the following steps: (1) mixing thermosetting resin with a flame retardant to obtain a binding material; (2) uniformly mixing polystyrene foaming particles with the binding material to obtain a formed material; and (3) adding a curing agent into the formed material, carrying out mixing,and then carrying out mechanical pressurizing forming to obtain the modified polystyrene board. According to the invention, a conventional method of modified polystyrene board secondary foaming and water vapor forming is replaced by the method combining phenolic resin foaming binding with mechanical pressurization, so that the process is simple, polystyrene board wastes can be effectively utilized, zero pollutant emission can be realized, waste polystyrene beads which are difficult to treat are consumed, the cost is reduced, and the environment-friendly process is realized. In a preferable technical scheme, a foaming agent is added into the binding material, so that phenolic resin can be foamed, and the polystyrene board becomes more compact with the matching of mechanical pressure, so that the board has higher strength and heat-preservation performance.

Description

technical field [0001] The invention belongs to the field of modification of polystyrene boards, and in particular relates to a modified polystyrene board, a preparation method and an application. Background technique [0002] The existing phenolic modified polystyrene board production process generally includes several processes of pre-expansion, coating, drying, molding, and maintenance. The principle of the conventional production method is: first pre-foam the expandable polystyrene particles, Polystyrene beads are obtained, and then the polystyrene beads are mixed with thermosetting resin, curing agent, foaming agent, surfactant, etc., the resin is cured at this time, and a cured resin is formed on the surface of the polystyrene beads layer (or called coating layer), and then under steam pressure, the polystyrene beads are foamed for the second time, and the polystyrene beads after the second foaming are bonded to each other to obtain a polystyrene board . [0003] CN1...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/06C08L61/06C08L63/00C08K5/06C08K5/103C08K3/22C08K5/098C08J9/14
CPCC08J9/141C08J9/145C08J2203/14C08J2203/142C08J2325/06C08J2361/06C08J2363/00C08J2425/06C08J2461/06C08K2003/2227C08L25/06C08L61/06C08L63/00C08L2201/02C08L2203/14C08L2205/03C08K5/06C08K5/103C08K3/22C08K5/098
Inventor 李枝芳沈剑吕爱超
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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