A 6u high-density server system power supply structure

Abstract

The invention discloses a 6u high-density server system power supply structure, which includes a power distribution board, a system middle board, a middle board connector, and a node connector. The power distribution board is vertically connected to the system middle board through the middle board connector. The node connector is arranged on the front face of the system middle board, the middle board of the system is provided with ventilation holes of the middle board, the rear side of the system middle board is provided with a support plate, and the rear side of the support board is provided with a fan plate, so The middle plate, support plate, and fan plate of the system are parallel to each other and fixed by bolts. The support plate is provided with a support plate ventilation hole corresponding to the position of the middle plate ventilation hole. The hole position corresponds to the ventilation hole of the fan board. The lower end of the fan board is provided with a gold finger. The power distribution board is provided with a fan board power supply connector. The gold finger is connected to the fan board power supply connector. A fan socket is arranged on the side, and the fan socket is welded and fixed with the fan plate.

Description

technical field [0001] The invention relates to the technical field of server power supply, in particular to a 6u high-density server system power supply structure. Background technique [0002] With the rapid development of the Internet and the continuous rise of cloud computing technology, the online business volume continues to increase. The requirements for the data processing capability of the server in the computer room are also getting higher and higher. In order to achieve stronger computing power in a limited space, a high-density converged architecture server system came into being. For a typical 6U rack server deployed in a telecommunications room, the entire server adopts 4+1 redundant power supply, and 8 GPU nodes and 1 computing motherboard node are interconnected through the middle board to achieve powerful data computing performance. [0003] Generally, the power consumption of a single GPU is 300W. Each GPU node is integrated with 2 GPUs, so the total pow...

AI Technical Summary

Problems solved by technology

The 500A current is transferred from the power board to the system board, which brings great challenges to the current load capacity of the system board

[0004] In order to ensure that the heat of 6000W is taken out by the system fan, it is necessary to open cooling vents on the middle board, which will cause the bottleneck of the current path on the middle board

At the same time, the use of fans to carry out such a large amount of heat will inevitably increase the power supply requirements of the cooling fan and the power supply load of the mid-plane, and add fan sockets on the mid-plane. The number of fan sockets is large, occupying a lot of space on the mid-plane It will inevitably lead to the reduction of heat dissipation vents and limit the width of the current-carrying copper foil in the board, which will bring challenges to LAYOUT high-speed signal routing

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