Heat dissipation method of pluggable board card which adopts a heat conduction film

A heat dissipation method and heat conduction film technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of easy fluctuation of temperature control curve, insufficient heat conduction, poor temperature control effect, etc., to avoid partial The effect of high temperature, improved heat transfer efficiency, and shortened service life

Inactive Publication Date: 2018-12-18
SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems that the heat conduction is insufficient, the temperature control curve is prone to fluctuations, the temperature control effect is poor, and the board card cannot be plugged and unplugged, the present invention provides a heat dissipation method for a pluggable board card using a heat conducting film

Method used

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  • Heat dissipation method of pluggable board card which adopts a heat conduction film
  • Heat dissipation method of pluggable board card which adopts a heat conduction film
  • Heat dissipation method of pluggable board card which adopts a heat conduction film

Examples

Experimental program
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Effect test

Embodiment 1

[0036] A heat dissipation method for a pluggable board card using a heat conduction film, the specific method is as follows:

[0037] Use non-woven cloth soaked in organic cleaning agent to wipe and clean the upper surface of heating element 2 and the lower surface of cold plate 4 to ensure that there are no impurities on the contact surface of heating element 2 and cold plate 4; wherein the heating element is CPU and other Heating components; the organic cleaning agent is absolute ethanol or acetone.

[0038] Use a clean scraper to evenly coat the upper surface of the heating element 2 with the thermally conductive silicone grease 3, and place the cold plate 4 on the upper surface of the heating element 2; the thickness of the thermally conductive silicone grease 3 is 0.05mm-0.1mm.

[0039] Wipe and clean the upper surface of the cold plate 4 with a non-woven cloth soaked in an organic cleaning agent to ensure that there is no impurity on the contact surface between the cold ...

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PUM

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Abstract

The invention discloses a heat dissipation method of a pluggable board card adopting a heat conductive film, the method comprises bonding a polyimide film to an upper surface of a cold plate, inserting a pluggable board card with a heating element mounted thereon into a back plate, and tightly bonding the upper surface of the polyimide film to the chassis so that the polyimide film fills a gap between the chassis and the cold plate. Compared with the prior art, the heat dissipation method of the pluggable board card adopting the heat conduction film increases the heat conduction area and improves the heat conduction efficiency, so that the heat generated by the board card is timely and effectively transmitted to the machine case. The invention effectively avoids that the local temperatureof the CPU and other components of the board are too high due to the poor heat dissipation effect, which affects the performance of the board and shortens the service life of the board.

Description

technical field [0001] The invention relates to the technical field of board heat dissipation, in particular to a heat dissipation method for a pluggable board using a heat conduction film. Background technique [0002] The CPU and other components of the computer will generate heat during the working process. Heat dissipation is a process of heat conduction. The purpose is to transfer the heat generated by the CPU and other components to other media and control the temperature of the CPU and other components. within a stable range. The heat generated by the CPU and other components will eventually be dissipated into the air, and the heat transfer needs to pass through various cooling devices. [0003] The main ways of heat dissipation are heat conduction and heat convection. For the pluggable board module in a fully enclosed chassis, the heat dissipation is mainly through heat conduction and passive heat dissipation. The CPU and other components on the board of the existi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 孙永升陈晶李新富王晓辉
Owner SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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