A low-temperature preparation method of ceramic copper-clad laminate for high-power LED
A ceramic copper-clad laminate and high-power technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of interface pores and high bonding temperature, and achieve the effects of reducing production costs, lowering process temperature, and reducing interface micropores
Inactive Publication Date: 2018-12-18
NANYANG NORMAL UNIV
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Problems solved by technology
[0008] In view of this, the purpose of the present invention is to address the deficiencies in the prior art, to provide a low-temperature preparation method for ceramic copper-clad laminates for high-power LEDs, and to use electroless copper plating and copper-copper bonding methods to solve the problem of excessively high bonding temperatures (1000 ℃ above), interface porosity and other key technical problems, reduce the bonding temperature, increase the bonding strength, improve the bonding interface porosity and improve the thermal shock resistance of the product
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[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong ...
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The invention discloses a low-temperature preparation method of a ceramic copper-clad laminate for a high-power LED, comprising the following steps: 1, copper is plated on the surface of a ceramic substrate by an electroless copper plating method to obtain a ceramic copper-plated sheet; 2, anneal the ceramic copper plate sheet under a protective atmosphere; and 3, hot press bonding the anneal ceramic copper-plated sheet and the copper foil by using the copper-copper bonding method to obtain a ceramic copper-clad laminate for high-power LEDs. At that same time, electroless cop plating and cop bonding method are adopted to solve the key technical problems of excessive high bonding temperature (above 1000 DEG C) and interface pore, reduce bonding temperature, increase bonding strength, improve bonding interface pore and improve thermal shock resistance of products.
Description
technical field [0001] The invention belongs to the technical field of LED packaging substrate preparation, and in particular relates to a low-temperature preparation method of a ceramic copper-clad board for high-power LEDs. Background technique [0002] In the national medium and long-term scientific and technological development plan, semiconductor lighting with high efficiency, energy saving and long life is listed as the first priority theme (industrial energy conservation) in the first key field (energy), which has attracted widespread attention at home and abroad. Energy saving and emission reduction will be the top priority throughout the future development. LED lighting will definitely be valued by governments at all levels and the market because of its remarkable energy saving effect. my country's lighting electricity consumption accounts for about 13% of the country's electricity consumption, and it is of great significance to promote the use of high-efficiency li...
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Login to View More IPC IPC(8): H01L33/62
CPCH01L33/62H01L2933/0066
Inventor 刘旭焱屈重年海静李果张聪正
Owner NANYANG NORMAL UNIV