Electrical connection assembly, display device, and electrical connection method
A technology for electrically connecting components and display devices, applied in the direction of conductive adhesive connection, connection, contact parts, etc., can solve the problems of easy lateral contact, difficult control of the deformation of conductive particles 131, uneven distribution of conductive particles 131, etc., to achieve improved The effect of yield
Active Publication Date: 2018-12-18
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
[0004] However, the distribution of the conductive particles 131 in the conductive adhesive 13 is not uniform, and it is easy to cause conductive particles 131 to be pressed between some BondingPads 111 and the pins 121, while there is no conduction between some Bonding Pads 111 and the pins 121. Particle 131, such as figure 1 The area delimited by the dotted line in
In addition, the deformation of the conductive particles 131 is difficult to control, and it is difficult to realize directional conduction, such as figure 2 As shown in the area defined by the dotted line, a plurality of conductive particles 131 located between the Bonding Pad 111 and the pins 121 are easy to contact laterally, and lateral conduction is very likely to occur, resulting in two adjacent Bonding Pads 111 (or adjacent two pins) 121) between the electrical connection and cause a short circuit
It can be seen that the yield rate of the current Bonding process is low
Method used
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[0029] The following clearly and completely describes the technical solutions of each exemplary embodiment provided in the present application with reference to the drawings in the embodiments of the present application. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other. Moreover, the directional terms used throughout the application, such as "up", "down", etc., are for better describing the technical solutions of various embodiments, and are not used to limit the protection scope of the application.
[0030] image 3 is a schematic structural diagram of an electrical connection assembly according to an embodiment of the present application. combine Figure 3 ~ Figure 6 As shown, the electrical connection assembly 30 includes a first terminal 31 , a second terminal 32 and a conductive glue 33 . A plurality of first terminals 31 may be arranged at intervals along the horizontal direction on the first connect...
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Disclosed are an electrical connection assembly and a display device, and an electrical connection method. A first terminal includes a plurality of first conductive walls, A second terminal includes at least two second conductive walls, At that time of plug the first terminal and the second terminal, the first conductive wall and the second conductive wall are spaced apart in the horizontal direction, and deformed conductive particle with the insulation polymer layer broken are arranged between the adjacent two first conductive walls and between the adjacent first conductive wall and the second conductive wall and are electrically connected through the conductive particles, thereby achieving electrical connection. Based on this, the present application can be advantageous in improving theyield of the Bonding process.
Description
technical field [0001] The present application relates to the technical field of electronic equipment, in particular to an electrical connection assembly, a display device, and an electrical connection method. Background technique [0002] Currently, in order to meet the trend of thinner and thinner frame design of display devices, COF (Chip on Film, chip-on-film) technology has gradually become a mainstream. COF technology is a packaging technology that fixes the driver IC on a flexible circuit board, and its pins are electrically connected to the Bonding Pad (welding pad) of the display panel through Anisotropic Conductive Film (ACF). [0003] combine figure 1 with figure 2 As shown, in the Bonding process of a display device based on COF technology, the conductive glue 13 containing conductive particles 131 is first coated on the display panel 11, and then the display panel 11 and the COF 12 are relatively pressed together, for example, the The COF 12 is pressed again...
Claims
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IPC IPC(8): H01R13/02H01R4/04H01R43/00
CPCH01R4/04H01R13/02H01R43/00
Inventor 秦学思
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD