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A SMT dispense process for BGA chip

A dispensing process and chip technology, applied in the direction of printed circuits, electrical components, printed circuits connected with non-printed electrical components, can solve the problems of low production efficiency and high dispensing costs, and reduce equipment costs and operations. risk, reducing the effect of the production cycle process

Inactive Publication Date: 2018-12-18
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the object of the present invention is to provide a kind of BGA chip SMT dispensing process, to effectively solve the problem that BGA chip SMT dispensing cost is higher, production efficiency is lower

Method used

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  • A SMT dispense process for BGA chip
  • A SMT dispense process for BGA chip
  • A SMT dispense process for BGA chip

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Embodiment Construction

[0029] The embodiment of the invention discloses a BGA chip SMT glue dispensing process to reduce equipment costs and labor costs and improve production efficiency.

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] see Figure 1-Figure 3 , figure 1 It is a schematic flow sheet of the BGA chip SMT dispensing process of a specific embodiment of the present invention; figure 2 Set up the position diagram for the hot melt glue block; image 3 It is a schematic diagram of the thickness of the hot melt...

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Abstract

The invention discloses a SMT dispensing process of a BGA chip, comprising the following steps: S1, mounting a BGA chip on the SMT board surface of a board card; S2, a hot melt adhesive block is arranged at a preset position of the BGA chip; S3: the board provided with the hot melt adhesive block is reflow heated through a reflow soldering furnace, the hot melt adhesive block is heated to melt tobond the BGA chip and the PCB board, and the board is returned to a solid state after the board is out of the furnace. The SMT dispensing process of the BGA chip provided by the invention can completedispensing and curing operations in the SMT wire body, does not need to install a dispensing machine and a reflow soldering furnace outside the wire body, and reduces the equipment cost. Moreover, the off-line operation flow is not needed, the production circulation flow of the product is reduced, and the production efficiency is improved. The cost of manual operation is reduced, and the operation risk of the product is further reduced.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, and more specifically, relates to a BGA chip SMT glue dispensing process. Background technique [0002] In the current PCBA (Printed Circuit Board+Assembly) production in the electronics industry, the dispensing process is a relatively common process in the PCBA production process. The process is to put the liquid SMT glue on the fixed coordinate area through the glue dispenser, and then flow the board through the reflow oven to cure the glue at high temperature. SMT (Surface Mount Technology) patch adhesive mainly has the following functions: In the double-sided reflow soldering process, in order to prevent the large components on the soldered side from falling off due to the melting of the solder, the SMT patch adhesive should be fixed; the components should be reinforced. , prevent component displacement, and disperse the stress on the solder joints, especially for BGA chips (Bal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/34
CPCH05K1/181H05K3/3421H05K3/3494H05K2201/10628H05K2203/043
Inventor 姚翼文葛汝田
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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