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Shape memory alloy spacecraft landing buffer capable of being used repeatedly

A memory alloy, nickel-titanium memory alloy technology, applied in the direction of shock absorbers, shock absorbers, elastic shock absorbers, etc., can solve the problems of difficult to achieve automatic reset, unable to reuse, difficult to replace or maintain buffer devices, etc. The effect of high dissipation capacity, easy processing and installation, and simple structure

Active Publication Date: 2019-01-01
BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the landing process of a spacecraft, it is necessary to use a buffer device to reduce the impact on the internal personnel and loads, and the traditional buffer device usually uses the plastic deformation caused by the buckling of the aluminum honeycomb compression to buffer energy consumption, but the aluminum honeycomb compression occurs buckling Difficult to achieve automatic reset after that, and cannot be reused
Taking into account both benefits and costs, it is necessary to launch multiple personnel and materials in one flight mission. For this reason, the spacecraft needs to be able to perform multiple soft landings. However, it is difficult to replace or maintain traditional buffer devices in deep space environments such as the moon. Meet the requirements of the flight mission

Method used

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  • Shape memory alloy spacecraft landing buffer capable of being used repeatedly
  • Shape memory alloy spacecraft landing buffer capable of being used repeatedly
  • Shape memory alloy spacecraft landing buffer capable of being used repeatedly

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Embodiment

[0029] A reusable shape memory alloy spacecraft landing buffer, a schematic diagram of a single-layer wave-shaped buffer structure is shown in figure 1 As shown, the single-layer wave-shaped cushioning structure is pressed by a mold and heat-treated to shape the single-layer wave-shaped cushioning structure to make it wave-shaped.

[0030] Two single-layer wave-shaped buffer structures are connected, so that the lowest point of the upper wave-shaped single-layer buffer structure and the highest point of the lower single-layer wave-shaped buffer structure are staggered or welded to form a double-layer wave-shaped buffer structure, such as figure 2 shown.

[0031] The pore block shape memory alloy structure formed after multiple bonding or welding according to the above method; the pore block shape memory alloy structure is installed between two planes that need to be buffered to form a buffer, such as image 3 As shown, in the process of landing buffer, relative motion occurs...

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Abstract

The invention discloses a shape memory alloy spacecraft landing buffer capable of being used repeatedly. A pore blocky shape memory alloy structure formed by bonding multiple layers of wave buffer structures is adopted, energy is consumed through the phase change process of a shape memory alloy material in the deformation process, and the effect of buffer energy absorption is achieved; and meanwhile through the memory effect of the shape memory alloy material to the initial shape, the shape memory alloy material can restore to the initial shape in a heating manner, and therefore buffer is achieved, and the buffer can be used repeatedly.

Description

technical field [0001] The invention relates to a reusable shape memory alloy spacecraft landing buffer, belonging to the technical field of spacecraft landing buffers. Background technique [0002] During the landing process of a spacecraft, it is necessary to use a buffer device to reduce the impact on the internal personnel and loads, and the traditional buffer device usually uses the plastic deformation caused by the buckling of the aluminum honeycomb compression to buffer energy consumption, but the aluminum honeycomb compression occurs buckling After that, it is difficult to realize automatic reset and cannot be reused. Taking into account both benefits and costs, it is necessary to launch multiple personnel and materials in one flight mission. For this reason, the spacecraft needs to be able to perform multiple soft landings. However, it is difficult to replace or maintain traditional buffer devices in deep space environments such as the moon. Meet the requirements o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16F7/12
CPCF16F7/128
Inventor 龙龙王永滨王立武梁浩武士轻朱谦冯蕊霍东阳刘欢刘媛媛
Owner BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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