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Structure and method for adjusting transmission line impedance in vertical direction

A vertical direction, transmission line technology, applied in the direction of electrical connection of printed components, printed circuit components, printed circuits, etc., to achieve uniform insertion loss and small reflection

Active Publication Date: 2021-05-07
PHOTONIC TECH SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] For low-impedance wiring requirements, such as laser drivers that require 25Ohm transmission lines, further reduction of via inductance may be required, and as the rate of digital signals becomes higher and higher, it must be implemented in a wider frequency band. The continuation of signal impedance is a great challenge to traditional technology. Adopting this traditional technical solution

Method used

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  • Structure and method for adjusting transmission line impedance in vertical direction
  • Structure and method for adjusting transmission line impedance in vertical direction
  • Structure and method for adjusting transmission line impedance in vertical direction

Examples

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Embodiment 1

[0051] Such as Figure 5 As shown, this embodiment provides a structure 2 for adjusting the impedance of the transmission line in the vertical direction, and the structure 2 for adjusting the impedance of the transmission line in the vertical direction includes:

[0052] a first metal layer 211, a second metal layer 212 located in two parallel planes, and a first via hole 221 connected between the first metal layer 211 and the second metal layer 212;

[0053] Wherein, the first via hole 221 includes at least two via holes arranged in parallel; and the areas of the first metal layer 211 and the second metal layer 212 are larger than the sum of the cross-sectional areas of the via holes connected thereto. .

[0054] Such as Figure 5 As shown, the first metal layer 211 is connected to a first signal transmission line 231 for transmitting signals.

[0055] Specifically, in this embodiment, the first metal layer 211 has a rectangular structure. In actual use, the shape of the f...

Embodiment 2

[0065] Such as Figure 6 As shown, this embodiment provides a structure 2 that adjusts the impedance of the transmission line in the vertical direction. The difference between this embodiment and Embodiment 1 is that this embodiment includes a stacked structure of metal layers and vias, so More precise control over characteristic impedance.

[0066] Such as Figure 6 As shown, the structure 2 for adjusting the impedance of the transmission line in the vertical direction includes:

[0067] The first metal layer 211, the second metal layer 212, the third metal layer 213, the fourth metal layer 214, the fifth metal layer 215 arranged in parallel on different planes, and the first via hole 221 arranged between each metal layer , the second via hole 222 , the third via hole 223 and the fourth via hole 224 .

[0068] Such as Figure 6 As shown, the first metal layer 211, the second metal layer 212, the third metal layer 213, the fourth metal layer 214 and the fifth metal layer 2...

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Abstract

The present invention provides a structure and method for adjusting the impedance of a transmission line in a vertical direction, comprising: a first metal layer, a second metal layer located on two parallel planes, and a metal layer connected between the first metal layer and the second metal layer A first via hole; wherein the first via hole includes at least two via holes arranged in parallel; and the areas of the first metal layer and the second metal layer are both greater than the sum of the cross-sectional areas of the via holes connected thereto. Adjust the area of ​​the metal layer to control the capacitive reactance of the via area, and adjust the number and connection relationship of the vias to control the inductive reactance of the via area, so that the characteristic impedance of the via hole matches the characteristic impedance of the signal transmission line. The present invention adopts a precise impedance control method, so that the signal can maintain the impedance consistency in a wider frequency range, has smaller reflection for ultra-high-speed and higher-order signal transmission, and has more uniform insertion loss, which can meet the requirements of 200G optical communication. , 400G and 800G chip packaging and signal transmission design requirements.

Description

technical field [0001] The invention relates to the communication field, in particular to a structure and a method for adjusting transmission line impedance in the vertical direction. Background technique [0002] It can be known from the microstrip or strip transmission line theory that the transmission line can be equivalent to a collection of inductance L, resistance R, capacitance C and conductance G from a microscopic point of view, such as figure 1 shown. For a lossless transmission line, ignoring R and G, directly approximated as L and C, the characteristic impedance of the transmission line is approximated as: [0003] That is, the characteristic impedance is determined by the equivalent inductance L and equivalent capacitance C of the infinitely small line segment. [0004] Walking the signal line on the PCB (Printed Circuit Board, printed circuit board or printed circuit board) circuit board will inevitably encounter the need for vias to realize the connection ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11
CPCH05K1/115H05K1/116
Inventor 孙全辉商俊强马建旭
Owner PHOTONIC TECH SHANGHAI CO LTD