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A thin-walled liquid-cooled cold plate

A liquid-cooled cold plate and thin-walled technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of deformation of the lower substrate, large cavity, and no strong support of the lower substrate, etc.

Active Publication Date: 2020-04-17
贵州永红换热冷却技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since this place is a liquid inlet, there is no strong support with the lower substrate, the cavity is large and the wall thickness is thin, resulting in deformation of the lower substrate

Method used

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  • A thin-walled liquid-cooled cold plate
  • A thin-walled liquid-cooled cold plate
  • A thin-walled liquid-cooled cold plate

Examples

Experimental program
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Embodiment Construction

[0019] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0020] Such as Figure 1~4 As shown, it is the thin-walled liquid-cooled cold plate structure of the present invention, including the anti-deformation boss 1 at the inlet and outlet positions, the middle rib 2, the reinforcing rib 3, the upper base plate 8, the lower base plate 4, the transition cavity 5, the single Channel 6, inlet and outlet nozzles 7, weight reducing grooves 9, fins 10, reinforcing cylinders 12 and mounting threaded holes 13.

[0021] Such as figure 1 As shown, in order to solve the failure mode existing in the thin-walled liquid-cooled cold plate, the anti-deformation boss 1 is added at the position of the lower base plate 4 facing the inlet and outlet nozzles 7 during design. The anti-deformation boss 1 is a hollow with a spherical shape at one end. Cylinder, the diameter D of the anti-deformation boss 1 is the diameter of the...

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PUM

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Abstract

The invention discloses a thin-walled liquid cooling cold plate. The thin-walled liquid cooling cold plate comprises a lower substrate (4), transition cavities (5) and a single channel (6); positions,directly facing an inlet and outlet nozzles (7) respectively, on the lower substrate (4), are provided with anti-deformation bosses (1); intermediate ribs (2) and reinforcing cylinders (12) are arranged in the transition cavities (5); and a reinforcing rib (3) extending to a direction consistent with the direction of the single channel (6) is arranged in the single channels (6). The thin-walled liquid cooling cold plate of the invention successfully satisfies the requirements of various performance indicators. Under a condition that the minimum wall thickness of an upper substrate and the lower substrate is 1 mm, the thin-walled liquid cooling cold plate can resist pressure of 1.5 MPa and can avoid leakage and deformation; the thin-walled liquid cooling cold plate can pass vibration intensity assessment; helium mass spectrometer leak detection meets design requirements. With the thin-walled liquid cooling cold plate of the invention adopted, an effective solution is provided for the weight reduction of aerospace products with product strength ensured.

Description

technical field [0001] The invention relates to a liquid-cooled cold plate used for cooling aerospace electronic equipment, in particular to a structure for improving the strength of a thin-walled liquid-cooled cold plate. Background technique [0002] With the improvement of electronic system integration, electronic equipment is gradually developing towards large capacity, high density, and high integration. Due to the increase in power density of a single module, air-cooled heat dissipation technology is far from meeting the requirements, and liquid-cooled cold plate technology has become the next step. The first choice for the cooling of modern high-tech electronic equipment. Especially in the field of aerospace, in addition to requiring liquid-cooled cold plates to meet the thermal performance requirements of electronic equipment and system resistance requirements, higher requirements are also placed on the weight of products. In order to meet the overall weight require...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20254
Inventor 贾希萍李新运王家喜
Owner 贵州永红换热冷却技术有限公司