Sealing structure, method for manufacturing same, and sealing material
A technology of sealing structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor device, electric solid-state device and other directions, can solve the problems of difficult external connection of terminals, narrow spacing between terminals, and difficulty in ensuring connection reliability, etc. The effect of simplifying the wiring formation process
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Embodiment 1
[0133] (preparation of varnish)
[0134] The varnish (varnish-like resin composition) having the composition shown in Table 1 was prepared as follows. 100 g of component D was put into a 10 L container made of polyethylene. Next, after adding 750.8 g of component B3 to a container, component B3 was dispersed using the stirring blade, and the dispersion liquid was obtained. 90.1 g of component a11, 31 g of component a13, 24 g of component a14, 9 g of component a15, and 93.1 g of component a21 were added to this dispersion liquid, followed by stirring. After confirming that component a21 was dissolved, 1.9 g of component a3 was added, and stirring was further performed for 1 hour. The resulting mixture was filtered through #200 mesh (opening diameter: 75 μm) made of nylon. The filtrate was collected to obtain a varnish.
[0135] (Production of sealing material A)
[0136] Apply the above-mentioned varnish on copper foil (manufactured by Nippon Denkai Co., Ltd., trade name: ...
Embodiment 2
[0180]689.6g of component B1 was used as an inorganic filler, 130.5g of component a11, 37.1g of component a12, and 17.1g of component a13 were used as an epoxy resin, 123.5g of component a22 was used as a curing agent, and 2.3g of component a3 was used Except not using an elastomer-containing epoxy resin as a hardening accelerator, it carried out similarly to Example 1, and prepared the varnish (varnish-like resin composition) which has the composition shown in Table 1. Then, it carried out similarly to Example 1, the sealing material was produced, and each measurement was performed. The measurement results are shown in Table 1.
Embodiment 3
[0182] Use 802.2g of component B1 as an inorganic filler, use 96.1g of component a11 and 24g of component a13 as an epoxy resin, use 76.1g of component a23 as a curing agent, use 1.5g of component a3 as a curing accelerator, and use no Except for the elastomer-containing epoxy resin, it carried out similarly to Example 1, and prepared the varnish (varnish-like resin composition) which has the composition shown in Table 1. Then, it carried out similarly to Example 1, the sealing material was produced, and each measurement was performed. The measurement results are shown in Table 1.
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