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Insulation layer manufacturing method and multilayer printed circuit board manufacturing method

A multi-layer printing and insulating layer technology, applied in the directions of printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve the problems of easy cracking of the insulating layer and difficult to match the thickness, etc.

Active Publication Date: 2019-01-04
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The limitation is that the insulating layer is prone to cracking during physical removal and it is difficult to easily match the desired thickness

Method used

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  • Insulation layer manufacturing method and multilayer printed circuit board manufacturing method
  • Insulation layer manufacturing method and multilayer printed circuit board manufacturing method
  • Insulation layer manufacturing method and multilayer printed circuit board manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0170] (1) Manufacture of insulating layer

[0171] Polymerization obtained by mixing 16 g of the alkali-soluble resin synthesized in Production Example 1, 5 g of MY-510 (manufactured by Huntsman) as a heat-curable binder, and 35 g of SC2050 MTO (manufactured by Adamatech) as an inorganic filler The polymer resin composition was coated on an untreated PET film with a thickness of 25 μm and dried to prepare a polymer resin layer with a thickness of 18 μm.

[0172] Then, a dry film (RY-5319, Hitachi Kasei) was laminated on a copper foil laminate (LG-500GAVB / VB, LG Chem.) with a carrier copper foil attached to form a pattern, and electroplating was performed by the MSAP method to form a circuit. After that, a dry film (RY-5319, Hitachi Kasei) was laminated on the above circuit to be patterned, and electroplating was performed to form copper bumps with a height of 15 μm and a diameter of 20 μm.

[0173] Subsequently, a polymer resin layer was vacuum-laminated at 85° C. on the co...

Embodiment 2

[0178] An insulating layer and a multilayer printed circuit board were manufactured in the same manner as in Example 1, except that the alkali-soluble resin synthesized in Production Example 2 was used instead of the alkali-soluble resin synthesized in Production Example 1 in the manufacturing method of the insulating layer in Example 1. Alkali-soluble resins synthesized in

Embodiment 3

[0180] An insulating layer and a multilayer printed circuit board were manufactured in the same manner as in Example 1, except that the alkali-soluble resin synthesized in Production Example 3 was used instead of the alkali-soluble resin synthesized in Production Example 1 in the manufacturing method of the insulating layer in Example 1. Alkali-soluble resins synthesized in

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Abstract

The present invention relates to an insulation layer manufacturing method according to which the efficiency of the process may be improved since manufacturing is achieved by a quicker and easier method, the physical damage to an insulation layer may be prevented, and it is easy to control the thickness, and to a multilayer printed circuit board manufacturing method using an insulation layer obtained by the said insulation layer manufacturing method.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2016-0138673 filed on October 24, 2016 and Korean Patent Application No. 10-2017-0136513 filed on October 20, 2017 and interests, the disclosure of which is incorporated herein by reference in its entirety. [0003] The invention relates to a method for producing an insulating layer and a method for producing a multilayer printed circuit board. More particularly, the present invention relates to a method for manufacturing an insulating layer, which can be manufactured in a faster and simpler manner, can improve process efficiency, can prevent physical damage to the insulating layer, and can easily adjust the layer thickness; and A method of manufacturing a multilayer printed circuit board using the insulating layer obtained by the method of manufacturing the insulating layer. Background technique [0004] Recent electronic device...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/03C08L79/08C08K3/00
CPCC08L79/085C08K3/013H05K1/0313H05K1/0353H05K1/0373H05K3/4647H05K3/467
Inventor 郑遇载庆有真崔炳柱崔宝允李光珠郑珉寿
Owner LG CHEM LTD
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