A microelectronic device packaging mechanism
A technology for microelectronic devices and packaging machines, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as reduced work efficiency, reduced product qualification rate, and easily damaged packaging effects, and achieves faster collection. The effect of ensuring the quality of packaging
Inactive Publication Date: 2019-01-08
安徽星宇生产力促进中心有限公司
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Problems solved by technology
[0003] The existing microelectronic device packaging mechanism directly dries the microelectronics after packaging. Due to the large temperature difference of the packaging, the packaging effect is easily damaged, which reduces the pass rate of the product, and at the same time, there will be retention when the microelectronic device is transported. ,decrease productivity
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[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0018] see Figure 1-3 , the present invention provides a technical solution: a microelectronic device packaging mechanism, including a work table 1, a packaging machine 2 and a conveyor 11, the packaging machine 2 is arranged on the top of the work table 1, and is connected to the work table 1 through screws Fixedly connected, the conveyor 11 is arranged on one side of the work table 1, and is at the same level as the work table 1; the top of the conveyor 11 ...
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The invention discloses a microelectronic device packaging mechanism, comprising a work table, a packaging machine and a conveyor. The packaging machine is arranged on the top of the work table and isfixedly connected with the packaging machine through screws. The conveyor is arranged on one side of the work table and is in the same horizontal plane with the work table. The top of the conveyor isprovided with an L-shaped plate, and the L-shaped plate is fixedly connected with the conveyor through screws, the surface of the L-shaped plate is provided with a straight rod, A microelectronic device packaging mechanism by means of a heating plate arranged at one end of the straight rod, When the electricity is turned on it generates a certain amount of heat, The invention ensures that the heat dissipation is carried out under the condition that the microelectronic device moving on the conveyor keeps a certain temperature, and the influence of the temperature difference on cooling is not large, thereby ensuring the packaging quality of the electronic device. At the same time, the pulley arranged on the surface of the rotating rod can facilitate the movement of the electronic device onthe oblique slide plate, thereby avoiding the problem of retention and accelerating the collection speed.
Description
technical field [0001] The invention relates to the technical field of packaging mechanisms, in particular to a packaging mechanism for microelectronic devices. Background technique [0002] Packaging refers to connecting the circuit pins on the silicon chip to the external joints with wires so as to connect with other devices. The packaging form refers to the shell used to install the semiconductor integrated circuit chip. It not only plays the role of installation, fixing and sealing. , Protect the chip and enhance the electrothermal performance, etc., and also connect the contacts on the chip to the pins of the package shell with wires, and these pins are connected to other devices through the wires on the printed circuit board, so as to realize the internal The connection between the chip and the external circuit, because the chip must be isolated from the outside world to prevent the impurities in the air from corroding the chip circuit and causing electrical performanc...
Claims
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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67103H01L21/67706
Inventor 吴胜松叶桂如吴胜琴
Owner 安徽星宇生产力促进中心有限公司