A laser rotary cutting marking method on the surface of hard and brittle materials

A hard and brittle material, laser marking machine technology, applied in the direction of laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of material cracking, affecting the clarity of marking, etc., to avoid cracking, good marking effect, good effect clear effect

Active Publication Date: 2021-02-12
JIANGSU UNIV
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The cost of fiber laser marking machine is low, and it has been widely used in plastics, steel and other materials. However, when fiber laser marking machine is used for laser marking on glass, ceramics and other hard and Stress gradient, the laser marking area on the surface of hard and brittle materials is easy to form microcracks, these cracks perpendicular to the laser moving direction will form new cracks, expand to the area near the original mark to form fragments, when the line width of the notch is small, These micro-cracks and chips can seriously affect the legibility of markings and in severe cases even crack the material

Method used

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  • A laser rotary cutting marking method on the surface of hard and brittle materials

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Embodiment

[0015] In this example, the laser is a pulsed fiber laser, the single pulse energy of the laser is 1mj, the frequency is 20KHZ, the pulse width of the laser beam is 10ns, the wavelength is 1064nm, the diameter of the laser spot is 0.05mm, the scanning speed is 1m / s, and the hard and brittle material is nitrogen Silicon. The shape of the character is number 2, and the width W is 0.14mm. Specific steps are as follows:

[0016] Step 1: Determine the fitting path 4 of laser marking as the number "2";

[0017] Step 2: According to the laser spot diameter and the character width, the number of rotary cutting paths scanned by the laser is n=3, the radius R1 of the first rotary cutting path 1 is 0.025mm, and the radius R2 of the second rotary cutting path 2 is 0.075mm. The radius R3 of the three rotary cutting paths 3 is 0.125 mm, and the distance between adjacent rotary cutting paths is 0.05 mm.

[0018] Step 3: Make the laser beam of the laser marking machine complete the first r...

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Abstract

The invention relates to the field of surface treatment, in particular to a laser rotary cutting marking method on the surface of hard and brittle materials. Laser marking with pulsed fiber laser can make the edge of the marking line have better definition; using rotary cutting method for laser marking can ensure that there will be no edge cracking during the entire laser marking process, so that It ensures the clarity of marking and avoids the cracking of hard and brittle materials; since each rotary cut is circular, the reflection of light in all directions is the same, so the marking effect can be observed clearly from different directions; the unit Using no more than 3 rotary cutting paths can ensure that the inside of the marked graphics or characters is fully filled and has a good marking effect; the distance between adjacent rotary cutting paths is d, which can make the adjacent rotary cutting paths form a The clear dividing line forms a frosted effect under the light, further improving the clarity of marking.

Description

technical field [0001] The invention relates to the field of surface treatment, in particular to a laser rotary cutting marking method on the surface of hard and brittle materials. Background technique [0002] The cost of fiber laser marking machine is low, and it has been widely used in plastics, steel and other materials. However, when fiber laser marking machine is used for laser marking on glass, ceramics and other hard and Stress gradient, the laser marking area on the surface of hard and brittle materials is easy to form microcracks, these cracks perpendicular to the laser moving direction will form new cracks, expand to the area near the original mark to form fragments, when the line width of the notch is small, These micro-cracks and chips can seriously affect the legibility of markings and in severe cases even crack the material. Therefore, it is necessary to develop a new fiber laser marking process for hard and brittle materials. Contents of the invention [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/362B23K26/70
CPCB23K26/362B23K26/361B23K26/70B23K26/702
Inventor 戴峰泽田勇
Owner JIANGSU UNIV
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