Novel oxidation-resistant quarternary alloy solder

A quaternary alloy and anti-oxidation technology, which is applied in the sealing of ceramics and metals, and in the field of silver-based solder, can solve the problems of increasing solder cost, waste of resources, affecting the use of solder sealing, etc., and achieves the improvement of oxidation resistance Effect

Inactive Publication Date: 2019-01-11
WUXI RIYUE ALLOY MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the silver content of Ag72Cu28 brazing material is as high as 72%, and there are the following problems: one is that silver element is a precious metal element, and the price is higher, and the brazing material with high silver content greatly increases the cost of solder; the other is that silver element is a rare metal in the earth's crust , excessive exploitation leads to waste of resources
Searching the patents of low-silver alloy solders that have been published so far, it is found that although the silver content of some patents can be reduced, the mechanical properties and welding temperature of the solder are basically the same as those of Ag72Cu28 solder, but the oxidation resistance of the solder is always difficult to guarantee, which greatly affects Solder sealing use

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A preparation method of the novel anti-oxidation quaternary alloy solder, the preparation method comprising the steps of:

[0021] (1) Ag, Cu, Ge and Si with a purity of 99.9% are mixed according to the composition ratio of each element (see Table 1 for the amount of each element);

[0022] (2) Put it into a vacuum induction melting furnace, start heating after the vacuum degree in the furnace reaches 0.04Pa, raise the furnace temperature to 1200°C, and keep it warm for 30 minutes;

[0023] (3) After the alloy is completely melted, fill it with nitrogen gas, cool down to about 1000°C, and then pour the molten metal into the mold to obtain a solder alloy ingot;

[0024] (4) Peel the ingot, remove the oxide, then carry out cold rolling, and roll to a thickness of 1mm;

[0025] (5) Annealing at a temperature of 650°C, and then cold rolling to a 0.05mm thick foil.

Embodiment 2

[0027] A preparation method of the novel anti-oxidation quaternary alloy solder, the preparation method comprising the steps of:

[0028] (1) Ag, Cu, Ge and Si with a purity of 99.9% are mixed according to the composition ratio of each element (see Table 1 for the amount of each element);

[0029] (2) Put it into a vacuum induction melting furnace, start heating after the vacuum degree in the furnace reaches 0.2Pa, raise the furnace temperature to 1250°C, and keep it warm for 40 minutes;

[0030] (3) After the alloy is completely melted, fill it with nitrogen gas, cool down to about 1000°C, and then pour the molten metal into the mold to obtain a solder alloy ingot;

[0031] (4) The ingot is peeled, oxides are removed, and then cold rolled to a thickness of 1.5 mm;

[0032] (5) Annealing at a temperature of 650° C., and then cold rolling to a foil with a thickness of 0.07 mm.

Embodiment 3

[0034] A preparation method of the novel anti-oxidation quaternary alloy solder, the preparation method comprising the steps of:

[0035] (1) Ag, Cu, Ge and Si with a purity of 99.9% are mixed according to the composition ratio of each element (see Table 1 for the amount of each element);

[0036] (2) Put it into a vacuum induction melting furnace, start heating after the vacuum degree in the furnace reaches 0.4Pa, raise the furnace temperature to 1300°C, and keep it warm for 50 minutes;

[0037] (3) After the alloy is completely melted, fill it with nitrogen gas, cool down to about 1000°C, and then pour the molten metal into the mold to obtain a solder alloy ingot;

[0038] (4) peel the ingot, remove the oxide, then carry out cold rolling, and roll to a thickness of 2mm;

[0039] (5) Annealing at a temperature of 650° C., and then cold rolling to a 0.1 mm thick foil.

[0040] Table 1 (unit: weight %)

[0041] Example

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Abstract

The invention discloses a novel oxidation-resistant quarternary alloy solder. The solder is prepared from the following elements in percentage by weight: 45-50% of Ag, 48.6-52.2% of Cu, 1-2% of Ge and0.4-0.8% of Si. The oxidation-resistant low-silver alloy solder is high in machinability, high in wettability, high in sealing joint strength and high in oxidation resistance, can replace Ag72Cu28 solder which is widely used at present, and is especially applied to sealing of ceramics and metals in electrical vacuum devices.

Description

technical field [0001] The invention belongs to the field of welding, and relates to a silver-based solder with low silver content, which is suitable for sealing ceramics and metals in electric vacuum devices. Background technique [0002] Silver-based solder has excellent properties (such as mechanical properties, electrical conductivity, corrosion resistance, and joint airtightness), and is widely used as a vacuum sealing solder. Ag72Cu28 alloy has a eutectic alloy structure with a eutectic melting point of 779°C and a sealing temperature of about 830°C. It has good wettability and fluidity to metals and ceramics, and is easy to process into sheets and wires. It does not contain volatile elements. , to meet the requirements of electric vacuum devices. However, the silver content of Ag72Cu28 brazing material is as high as 72%, and there are the following problems: one is that silver element is a precious metal element, and the price is higher, and the brazing material with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/40B23K35/14
CPCB23K35/0233B23K35/3006B23K35/40
Inventor 晏弘
Owner WUXI RIYUE ALLOY MATERIALS
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