A mechanical device for transporting silicon wafers

Abstract

The invention relates to a mechanical device for transporting a silicon wafer, comprising an X-axis drive mechanism, Z-axis drive mechanism, Z-axis rotary drive mechanism, two sets of independent Y-axis drive mechanism, first hand fork, a second hand fork and a correction device, wherein the X-axis driving mechanism is provided with a Z-axis driving mechanism. The Z-axis driving mechanism is provided with a Z-axis rotating driving mechanism, two sets of independent Y-axis driving mechanisms are provided with the Z-axis rotating driving mechanism, two sets of independent Y-axis driving mechanisms are provided with the Z-axis rotating driving mechanism for driving the first hand fork and the second hand fork to perform horizontal telescopic movement, and the correcting device is arranged onthe housing of the Z-axis driving mechanism. The mechanical device of the invention has the advantages of high working efficiency, stable and reliable working process, high degree of freedom, and integrates the picking-up and sending mechanism and the correcting device together, thereby improving the equipment integration level and increasing the output.

Description

technical field [0001] The invention relates to a transport device, in particular to a mechanical device for transporting silicon wafers. Background technique [0002] At present, in the semiconductor industry, because silicon wafers are very expensive, and the requirements for mechanical particles on the surface of silicon wafers are also very high in the process of manufacturing, it is not only required to have a high stability of the pick-up and delivery device when picking up and delivering silicon wafers, but also requires Very high cleanliness. In production, silicon wafers need to be repeatedly transferred between various process equipments in a high-speed, precise, clean and absolutely safe manner, so a transfer device with high transfer efficiency and high stability is required to complete the process. [0003] Now the most widely used is a three-fold arm robot. This type of robot uses three joint structures of the main arm, the auxiliary arm and the wrist to conne...

AI Technical Summary

Problems solved by technology

[0003] Now the most widely used is a three-fold arm robot. This type of robot uses three joint structures of the main arm, the auxiliary arm and the wrist to connect the fork claws. Due to the many joints of the three-fold arm manipulator, there are problems of drooping and shaking at the end, and the transmission control is relatively complicated.

There is also a newly developed single-arm single-fork manipulator. Although this manipulator can avoid the complexity of the joints, it has the same defect as the three-fold arm manipulator: they are only on the main arm. Connect a fork, when the fork picks up and sends silicon wafers, since only one fork is working, there will be a time gap in the process of picking or placing, so that the work efficiency will be greatly reduced and the silicon wafer will be lengthened. Inactive time of manufacturing process

In order to improve efficiency, at present, the double-fork manipulator mostly used in the world is a double-three folding arm structure to realize the double-piece fork, which increases the relative complexity.

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