A method for predicting creep ageing behavior of aluminum-copper alloys under variable stress

An aluminum-copper alloy, creep aging technology, used in special data processing applications, computational models, biological models, etc.

Active Publication Date: 2019-01-15
CENT SOUTH UNIV
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Problems solved by technology

The invention solves the disadvantage that the existing method can only be used in a relatively narrow stress range, and has important guiding significance for accurately predic

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  • A method for predicting creep ageing behavior of aluminum-copper alloys under variable stress
  • A method for predicting creep ageing behavior of aluminum-copper alloys under variable stress
  • A method for predicting creep ageing behavior of aluminum-copper alloys under variable stress

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[0057] In the following, the method of the present invention will be further explained and the data will be illustrated in conjunction with the accompanying drawings and specific embodiments. The samples used in the examples are commercial 2219 aluminum alloys. Tensile test adopts the standard: GB / T 228-2002. The high-temperature creep aging test is carried out on the RMT-D10 electronic high-temperature creep durability tester produced by Sansi Taijie Company. The temperature control accuracy of the tester is ±2°C, and the load accuracy is ±3N.

[0058] The present invention provides a method for accurately predicting the creep aging behavior of an aluminum-copper alloy under variable stress. The following takes the prediction of the creep and aging strengthening behavior of a 2219 alloy (a typical aluminum-copper alloy) as an example to introduce the prediction method provided by the present invention in detail. And specific implementation details, the methods involved are a...

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Abstract

A method for predicting creep aging behavior of Al-Cu alloy unde variable stress is provided. The uniaxial tensile stress aging treatment was carried out on a creep tester, and the creep curves were obtained under different stress levels at specific temperatures. Then the tensile tests were carried out after air cooling to room temperature, and the yield strength changes under different stress aging were obtained. The evolution of dislocation density in step one creep process was calculated by X-ray diffraction method. The changes of theta 'and theta size and volume fraction of main strengthening phases in creep process were observed by transmission electron microscope. A unified macroscopic and microscopic constitutive model for predicting creep and age hardening of Al-Cu alloys under strain stress was established. The material constants are determined and the parameters in the model are obtained by particle swarm optimization algorithm. The invention solves the drawback that the prior method can only be used in a narrow stress range, has important guiding significance for accurately predicting creep deformation and property evolution under complex stress of practical materials and components, and can be applied to numerical simulation of component manufacturing.

Description

technical field [0001] The invention belongs to the technical field of aluminum alloy thermal processing and forming, and in particular relates to a method for predicting the creep aging behavior of aluminum-copper alloy under variable stress. Background technique [0002] Creep age forming (CAF) is commonly used to manufacture large aluminum alloy monolithic components in the aerospace industry. Through creep / stress relaxation and age hardening, the process enables simultaneous forming and strengthening of the sheet. Elastic deformation is transformed into plastic deformation through creep / stress relaxation, while the strength of the alloy is mainly improved by solid phase precipitation and dislocation proliferation during a small amount of creep aging forming. However, when the plate with ribs is in contact with the surface of the mold, it will be subject to complex and non-uniform stress. For example, the stresses in the reinforced areas are much higher, even exceeding ...

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Application Information

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IPC IPC(8): G06F17/50G06N3/00
CPCG06N3/006G06F2119/06G06F30/20
Inventor 刘春辉湛利华马子尧
Owner CENT SOUTH UNIV
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