Wafer slicing system and slicing method thereof

Abstract

The invention provides a wafer slicing system, which is used for slicing the wafers in a crystal boat to be separated, comprising an auxiliary crystal boat and an auxiliary platform, wherein the auxiliary crystal boat comprises a crystal boat body and a clamp bar; two sides of the crystal boat body are provided with a clamp slot; the clamp bar is correspondingly arranged in the clamp slot; the clamp bar can be operated to clamp or unlock the wafers in the clamp slot; The auxiliary platform comprises a slicing platform and an arm device, The auxiliary crystal boat is fixed on the slicing platform, the arm device is installed on one end of the slicing platform, the crystal boat to be separated is installed on the slicing platform between the arm device and the auxiliary crystal boat, and theauxiliary crystal boat is opposed to the opening of the crystal boat to be separated and folded, and the arm device can be telescoped and reciprocated on the slicing platform. The wafer splitting system has the advantages of simple operation, low cost and strong stability, and can complete the wafer transfer, especially can realize the wafer splitting and transfer in the designated card slot. Theinvention also provides a method for dividing a wafer by using the wafer dividing system.

Description

technical field [0001] The invention relates to the field of wafer testing, and in particular to a wafer slicing system and a slicing method thereof. Background technique [0002] At present, in the back-end process of the semiconductor industry, wafers need to be cut and packaged, and a wafer boat is required. This wafer boat has been widely used as an industry standard for many years. The standard wafer boat is mainly composed of three main parts: the main body with slots on both sides, the handle part and the retaining strip. Each side of the standard wafer boat contains 25 slots, and each slot corresponds to a wafer. [0003] During the wafer testing process, due to abnormal testing or special operation requirements, the robot arm of some equipment is too thick, and the gap between the slots of the wafer boat does not support the robot to pick and place the wafer. It is necessary to separate the wafers in the same wafer boat into two In a wafer boat or multiple wafer bo...

AI Technical Summary

Problems solved by technology

[0004] At this stage, wafer slicing techniques are usually used: (1) Using a vacuum pen to suck the back of the wafer for slicing. Although this technology can avoid artificial pollution, due to the uncontrollable pick-and-place process of the vacuum pen, falling The risk of chips and fragments is high, the stability of the manual operation of the suction pen is poor, and the risk of wafer scratches is high. Abnormal quality such as scratches, fragments, and mixed materials

(2) Use a manipulator that meets the thickness to make a slicing device. Although the slicing process is stable and it is not easy to cause damage to the product, the precision of the manipulator is high, and software development is required, resulting in high equipment costs.

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