Unlock instant, AI-driven research and patent intelligence for your innovation.

Radio frequency tag without PET film and manufacturing process of tag

A technology of radio frequency tags and manufacturing process, which is applied in the field of radio frequency tags, can solve the problems of waste liquid, waste water pollution, affecting the electrical performance of radio frequency tags, and unstable electrical connection of antennas, etc., so as to improve the anti-counterfeiting effect and printing effect Good, stable radio frequency performance

Active Publication Date: 2019-01-18
SHENZHEN JG TECH IND
View PDF10 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small area of ​​the aluminum foil of the chip connecting piece, the electrical connection with the antenna is unstable, which affects the electrical performance of the radio frequency tag, and the reading sensitivity changes greatly
[0005] ②The thickness of the PET film of the chip connection sheet is 50 μm, and the surface of the manufactured radio frequency has a protrusion of the PET film of the chip connection sheet, which affects the appearance of the label
[0006] ③The chip connection sheet still needs to be made by chemical etching process, which has not fundamentally solved the pollution problem of waste liquid and waste water

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radio frequency tag without PET film and manufacturing process of tag
  • Radio frequency tag without PET film and manufacturing process of tag
  • Radio frequency tag without PET film and manufacturing process of tag

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0047] It should be noted that when an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features.

[0048] see Figure 1 to F...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a manufacturing process of a radio frequency tag without a PET film. The process includes the steps of S10, manufacturing a resonant cavity chip assembly heat transfer coiled material, wherein the resonant cavity chip assembly heat transfer coiled material comprises the PET film and a resonant cavity chip assembly, and the resonant cavity chip assembly is connected to the PET film; S20, conducting heat transfer separating on the resonant cavity chip assembly, placing the manufactured resonant cavity chip assembly heat transfer coiled material on the inner surface of tagsurface paper 1, and separating the resonant cavity chip assembly and the PET film of the resonant cavity chip assembly heat transfer coiled material through a heat transfer machining station; S30, printing antenna fin pattern glue on the inner surface of the tag surface paper; S40, conducting punching or die-cutting on antenna fin aluminum foil, punching or die-cutting antenna fins on the aluminum foil, pressing the antenna fins on the antenna fin pattern glue, and meanwhile overlapping and connecting the resonant cavity chip assembly and the antenna fins; S50, combining the tag surface paperand tag bottom paper. The invention further provides the radio frequency tag without the PET film. The production efficiency is improved, and the pollution to the environment is reduced.

Description

technical field [0001] The invention belongs to the technical field of radio frequency tags, and in particular relates to a radio frequency tag without a PET film and a manufacturing process thereof. Background technique [0002] The radio frequency tag of the chemical etching antenna process has been widely used, but it also brings environmental protection problems. Like the similar process of corroding the copper foil of the circuit board, the chemical etching of the aluminum foil on the PET aluminum foil composite layer produces a large amount of waste water and pollutes the environment. The bigger the radio frequency tag is used, the more serious the environmental protection problem is. It is a very important issue to find out the method of making radio frequency tags without chemical etching. [0003] In order to reduce the workload of chemical etching of radio frequency antennas and reduce the discharge of waste liquid and waste water, die-cut antennas or die-cut anten...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B31D1/02G06K19/077
CPCB31D1/021B31D1/028G06K19/0772G06K19/07749
Inventor 焦林
Owner SHENZHEN JG TECH IND