A Speed ​​Planning Method for Picking and Placeing Components by Nozzles of Chip Mounter

Abstract

A speed planning method for pick-and-place components by the head nozzle of a chip mounter, comprising the following steps: 1) designing an S-type acceleration mode; The model of the feeder motor and the on-site test determine the maximum initial speed v min , and the maximum acceleration of the stepper motor a max and minimum velocity mutation a min ; 3) Design the asymmetric acceleration mode in the jerk section and the deceleration section, and calculate the accelerometer as (a 1 ,a 2 ,...,a m ) and (a m+1 ,a m+2 ,...,a n ); 4) calculate the corresponding speed table (v 1 ,v 2 ,...,v n+1 ); 5) In view of the variety of placement distances of the placement machine, two speed curves are set, according to whether the current speed is greater than the maximum speed v max and the current distance s p Whether it is satisfied or not is used to determine whether to enter the constant speed section or the deceleration section. The invention can effectively improve the running speed of the head of the placement machine, provide smoother speed planning, and avoid the problem of motor out-of-step and stalling under high-speed and high-acceleration conditions.

Description

technical field [0001] The invention relates to a speed planning method, in particular to a speed planning method for picking and placing components by a suction nozzle of a mounter head, and belongs to the field of motion control. Background technique [0002] In recent years, with the development of modern electronic technology, the production and manufacture of electronic equipment is developing in the direction of intelligence and high speed. The rapid development of electronic assembly technology is an important manifestation of the development of modern electronic technology. Surface mount technology (SMT) is currently the most popular technology and industry in the electronic assembly industry. It is a comprehensive technology involving multiple contents and mounting electronic components on PCB circuit boards. [0003] The electronic components on the PCB circuit board are small in size, and the intervals between the electronic components are very small and the arran...

AI Technical Summary

Problems solved by technology

[0004] In order to increase the speed during the pick-up and discharge movement of the suction nozzle of the existing placement machine, in order to overcome the influence of the component placement angle due to vibration during the rapid start and stop of the machine, and the motor head load due to high acceleration and deceleration And cause the problem of out-of-step stalling, the present invention provides a method that can realize the smooth start and stop of the stepping motor, speed up quickly, increase the maximum speed of the stepping motor, effectively avoid out-of-step and improve stability due to rapid acceleration to the highest speed. A revolutionary planning method for the speed planning of picking and placing components by the suction nozzle of the intelligent placement machine

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