A method and apparatus for disconnecting a metal wire for an image sensor chip

Abstract

The invention provides a method and and apparatus for disconnecting a metal wire for an image sensor chip. The first solder joint of the metal wire is electrically connected to the bonding pad of theimage sensor chip by a heating ultrasonic soldering mode, and the other end of the metal wire is truncated and suspended from the image sensor chip. A method and apparatus for disconnecting a metal wire for an image sensor chip, a first pad forming a metal wire is connected to a pad of the image sensor chip, The packaging structure with the other end suspended outside the image sensor chip increases the packaging flexibility of the image sensor chip, facilitates the positioning and assembly of the chip and the lens, improves the performance of the camera module, shortens the process flow, improves the yield of the product, and reduces the cost of the camera module.

Description

technical field [0001] The invention relates to a metal wire disconnection method and device for an image sensor chip. Background technique [0002] An image sensor is a sensor that senses optical image information and converts it into a usable output signal. Image sensors can improve the visual range of the human eye, enabling people to see the microcosm and macrocosm that cannot be seen by the naked eye, see what happens in places that people cannot reach temporarily, and see various physical and chemical changes beyond the visual range of the naked eye. Life, physiology, the occurrence and development of disease, and so on. It can be seen that image sensors play a very important role in people's culture, sports, production, life and scientific research. [0003] In practical applications, the image sensor performs its function of sensing optical image information and converting it into a usable output signal in the form of an image sensor chip. The image sensor chip is...

AI Technical Summary

Problems solved by technology

[0006] Existing packaging methods are likely to cause poor structural flexibility after packaging, high precision requirements for subsequent assembly of the camera module, and difficulty in controlling the relative position of the lens and image sensor chip, which affects the performance of the camera module; Long, low packaging efficiency, resulting in the image sensor chip being exposed to the air for a long time, requiring multiple inspections and cleaning, reducing the yield rate, and increasing the cost of the camera module

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