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Display panel, display device and display panel manufacturing method

A display panel and display area technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems that affect the display panel's film packaging performance, affect the display panel's bending resistance, and are prone to cracks, etc. Achieve the effects of enhancing lateral water resistance and bending resistance, improving bending resistance and film packaging performance, and having a small elastic modulus

Inactive Publication Date: 2019-01-18
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The retaining walls in the prior art often use organic acrylic materials. Due to the intolerance to bending of organic acrylic materials, cracks are prone to occur when the display panel is bent, which not only affects the bending resistance of the display panel, but also due to the expansion of cracks, Will further affect the thin film encapsulation performance of the display panel

Method used

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  • Display panel, display device and display panel manufacturing method
  • Display panel, display device and display panel manufacturing method
  • Display panel, display device and display panel manufacturing method

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Embodiment Construction

[0038] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0039] This embodiment provides a display panel, figure 1 is a schematic diagram of a display panel provided by an embodiment of the present invention, figure 2 yes figure 1 The sectional view of the middle display panel along the section line A1-A2, refer to figure 1 and figure 2 ,, the display panel includes:

[0040] A substrate 10, including a display area 11 and a non-display area 12 surrounding the display area 11;

[0041] an organic light emitting structure 20 located in the display area 11 of the s...

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PUM

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Abstract

The embodiment of the invention discloses a display panel, a display device and a manufacturing method of the display panel. The display panel includes: a substrate including a display area and a non-display area surrounding the display area; An organic light emitting structure located in a display region of the substrate; A retaining wall located in a non-display area of the substrate and surrounding the display area; The material of the retaining wall is an organic silicon material; A thin film encapsulation layer covering the organic light emitting structure, the thin film encapsulation layer comprising an inorganic layer and an organic layer arranged sequentially at intervals, and the organic layer is located in an area surrounded by the retaining wall. The scheme of the embodiment ofthe invention improves the bending resistance and the film encapsulation performance of the display panel.

Description

technical field [0001] Embodiments of the present invention relate to display technologies, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background technique [0002] Organic Light Emitting Diode (OLED) display is a kind of self-luminous display. Compared with liquid crystal display (liquid crystal display, LCD), OLED display does not require a backlight source, so OLED display is thinner and lighter. In addition, OLED display is also Due to the advantages of high brightness, low power consumption, wide viewing angle, high response speed, and wide operating temperature range, it is increasingly used in various high-performance display fields. [0003] In the prior art, a method of thin film encapsulation is often used to ensure that the organic luminescent material and electrodes are not corroded by water vapor and oxygen in the external environment. Generally, in order to prevent the organic material in the thin-fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8426H10K50/844H10K71/00
Inventor 肖玲
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD