High-power heat superconducting plate-fin combined radiator for rail transit

A rail transit and thermal superconducting technology, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problem of temperature rise of radiators and power devices, uneven temperature of power devices, and influence on power Device performance and other issues, to achieve the effect of increased pressure bearing capacity, enhanced thermal superconductivity thermal conductivity, and reduced weight

Pending Publication Date: 2019-01-18
ZHEJIANG JIAXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the above-mentioned radiator is used for heat dissipation of power devices such as rail transit, since the heat transfer fluids of the heat dissipation plates in the above-mentioned radiator are independently separated from each other, if the power devices in different regions have different powers, there will be power The problem of uneven temperature of the device; at the same time, when the short-term overload or fluctuation of the power device in the above heat sink generates a large amount of instantaneous heat, the heat cannot be dissipated in time, which makes the temperature of the heat sink and power device rise rapidly, thus affecting the performance of the power device

Method used

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  • High-power heat superconducting plate-fin combined radiator for rail transit
  • High-power heat superconducting plate-fin combined radiator for rail transit
  • High-power heat superconducting plate-fin combined radiator for rail transit

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Embodiment 1

[0111] see Figure 1 to Figure 11 , the present invention provides a high-power thermal superconducting plate-fin combined radiator for rail transit. The high-power thermal superconducting plate-fin combined radiator for rail transit includes: several thermal superconducting plates 10 arranged at intervals, Interconnected heat transfer channels (not shown) are formed in the thermal superconducting plate 10, and the heat transfer channels are filled with heat transfer working medium 1018; several groups of bottom substrate spacer groups, each group of the bottom substrate Each spacer group includes several first bottom substrate spacers 30, the first bottom substrate spacers 30 are located between some adjacent thermal superconducting plates 10, and are attached to the sides of the thermal superconducting plates 10. Surface; the surfaces on both sides of the first bottom substrate spacer 30 in contact with the thermal superconducting plate 10 are provided with first channels 30...

Embodiment 2

[0150] Please combine Figure 1 to Figure 19 refer to Figure 20 , this embodiment also provides a high-power thermal superconducting plate-fin combined radiator for rail transit. The structure of the high-power thermal superconducting plate-fin combined radiator for rail transit described in is roughly the same, the difference between the two is: the high-power thermal superconducting plate-fin combined radiator for rail transit described in this embodiment Compared with the high-power thermal superconducting plate-fin combined radiator for rail transit described in Embodiment 1, a phase-change storage material 80 is added, and the phase-change heat storage material 80 is at least partially filled in the sealed filling cavity 203 Inside. Of course, the phase change memory material 80 can be filled in all the sealed filling cavities 203 .

[0151] As an example, the phase-change thermal storage material 80 may include, but not limited to, a paraffin-based phase-change therm...

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PUM

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Abstract

The invention provides a high-power thermally superconducting plate-fin combined radiator for rail transit, comprising: a thermally superconducting plate; a plurality of first bottom substrate spacers, the first bottom substrate spacers being positioned between partially adjacent thermal superconducting plates; a surface contacting with that thermal superconducting plate on both side of the spacerstrip of the first bottom substrate is provided with a first channel, and a plurality of through holes are arrange on the spacer strip of the first bottom substrate; a second bottom substrate spacerstrip positioned between adjacent bottom substrate spacer strip groups; at least one side of that space strip of the second bottom substrate is provided with a second channel on the surface contactingwith the thermal superconducting plate; the surface of the thermally superconducting plate contacting with the spacer strip of the first bottom substrate and the surface of the thermally superconducting plate contacting with the spacer strip of the second bottom substrate are provided with connecting through holes. A heat dissipation fin located on at least one surface of the thermally superconducting plate; The flange is located at the periphery of the thermal superconducting plate, the first bottom substrate spacer, the second bottom substrate spacer and the heat dissipation fin. The invention can effectively solve the problem that the temperature of the power device is not uniform.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation equipment, in particular to a high-power thermal superconducting plate-fin combined radiator for rail transit. Background technique [0002] With the rapid development of power electronics technology, the requirements for modularization, integration, lightweight, low cost and high reliability are getting higher and higher. Therefore, in solar inverters, uninterruptible power supplies (UPS), charging piles, power MosFET (metal oxide semiconductor field effect transistor), Diode (diode), IGBT ( Insulated Gate Bipolar Transistors) and other power devices. As the integration of these power components is getting higher and higher, the power density is also increasing, and the heat generated by themselves during work is also increasing. If the heat generated by the power devices cannot be dissipated in time and quickly, it will lead to power failure. The temperature of the chip in the device ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20936H05K7/20881
Inventor 仝爱星曾巧唐必洪孙会会
Owner ZHEJIANG JIAXI TECH CO LTD
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