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Pre-plastic lead frame, semiconductor packaging structure and unit thereof, and packaging method

A technology for pre-plasticizing lead wires and lead frames, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc. Difficulty and production cost, improve quality and yield, reduce the effect of blade loss

Pending Publication Date: 2019-01-22
嘉盛半导体(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, when the semiconductor package structure is subsequently cut and separated, the metal connection bar has a relatively high hardness, which causes serious wear on the cutting blade.
In addition, cutting the connecting strip made of metal will also have the problem of metal residue, which will affect the quality of the final packaged product

Method used

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  • Pre-plastic lead frame, semiconductor packaging structure and unit thereof, and packaging method
  • Pre-plastic lead frame, semiconductor packaging structure and unit thereof, and packaging method
  • Pre-plastic lead frame, semiconductor packaging structure and unit thereof, and packaging method

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Embodiment Construction

[0062] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0063] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may a...

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PUM

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Abstract

The invention provides a pre-plastic lead frame, a semiconductor packaging structure and unit thereof, and a packaging method. the pre-plastic lead frame comprises a plurality of lead frame units, thelead frame units at least have a conductive element located on the outermost side, an insulating layer is embedded between the conductive elements of the adjacent lead frame units through a pre-plastic packaging process, and the insulating layer covers at least a part of the outer side walls of the conductive element. As that embodiment of the invention can carry out oxidation protection on the conductive element, the preparation process of the pre-plastic lead frame can be simplified and tightly connected, and the manufacturing cost can be reduced; In addition, the problem of metal residue existing in the prior art cutting is eliminated, and the quality and yield of the packaged product are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a pre-molded lead frame, a semiconductor packaging structure and its unit, and a packaging method. Background technique [0002] The statements in this section only provide background information related to the present disclosure and may not constitute prior art. [0003] Pre-molded lead frame is a new type of substrate for semiconductor packaging. Its design is flexible and diverse, and it is compatible with various packaging styles, such as flip chip (Flip Chip, FC), wire bonding (Wire Bonding), three-dimensional stacked packaging Wait. It is especially suitable for high-density multi-I / O packaging and can meet the packaging needs of different integrated circuit chips. Its typical structure is that several conductive columns and circuit layers are arranged independently of each other in the molding material. According to the needs of the product, the conductiv...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L21/48H01L21/67
CPCH01L23/49575H01L23/49586H01L21/4821H01L21/67144H01L2224/97H01L2924/181H01L2224/16245H01L2924/00012
Inventor 余训松朱健荣彭彧郑友君
Owner 嘉盛半导体(苏州)有限公司
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