Material unload device for automatic processing of a silicon wafer

Abstract

The invention relates to a material unload device for automatic processing of a silicon wafer which comprises a silicon wafer raw material conveyor belt, At that end of the silicon waf raw material conveyor belt, an inclined guide plate is arrange, A silicon wafer polishing mechanism is arranged below the material guide plate, one side of the silicon wafer polishing mechanism is provided with a silicon wafer finished blanking conveyor belt, a blanking conveyor mechanism is arranged between the silicon wafer polishing mechanism and the material guide plate, the silicon wafer polishing mechanismcomprises a polishing pan, a back surface of the polishing pan is connected with a first rotating motor, and a tail part of the first rotating motor is connected with a fixed lifting cylinder; A polishing station tray is arranged below the polishing pad, a plurality of polishing station grooves are arranged on the polishing station tray, the polishing station grooves run through the polishing station tray, a tray is arranged below the polishing station tray, and the surface of the tray is in contact with the bottom of the polishing station tray. The device realizes the automation of silicon wafer processing and blanking.

Description

technical field [0001] The invention relates to the field of silicon wafer processing, in particular to a blanking device for automatic processing of silicon wafers. Background technique [0002] Silicon raw materials are important semiconductor materials, and the chemical element symbol is Si. Silicon used in the electronics industry should have high purity and excellent electrical and mechanical properties. Silicon is the semiconductor material with the largest output and widest application. Its output and usage mark the electronic industry level of a country. When processing silicon wafers, silicon raw materials need to be evenly screened, and then fed through the feeding mechanism. And the silicon block raw material is imported into the silicon wafer processing equipment. The silicon wafer processing process includes squaring, cutting, grinding, polishing, and cleaning. After the silicon wafer raw material is cut, it needs to be polished with equal thickness. The current...

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Problems solved by technology

Silicon is the semiconductor material with the largest output and widest application. Its output and consumption mark the electronic industry level of a country. When processing silicon wafers, silicon raw materials need to be uniformly screened and then fed through the feeding mechanism. And the silicon block raw material is imported into the silicon wafer processing equipment. The silicon wafer processing process includes squaring, cutting, grinding, polishing, and cleaning. After the silicon wafer raw material is cut, it needs to be polished with equal thickness. The current silicon wafer processing equipment is in When polishing silicon wafers, the effect of equal thickness polishing cannot be achieved, and the silicon wafers are cut one by one after polishing, and the cutting efficiency is low

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