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A process for nickel-silver plating of silicon wafers

A technology of silicon wafer and nickel plating, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems of high toxicity, unfavorable operation, hidden safety hazard, etc., achieve low production cost and increase bonding force , the effect of strong reliability

Active Publication Date: 2021-08-10
TIANJIN HUANXIN TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the production process of silicon wafers in the existing technology, it is necessary to plate gold on the surface of the nickel layer to prevent the oxidation of the lower nickel layer. The main component of the gold plating solution currently used is potassium aurous cyanide, and the cost of potassium aurous cyanide itself is relatively high And it is highly toxic, transportation and storage require strict supervision procedures, which is not conducive to operation, and there are great safety hazards at the same time

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0031] A kind of nickel-silver plating process of this example comprises the following steps: pretreatment, primary nickel plating, nickel sintering, secondary nickel plating and silver plating, specifically,

[0032] During the pretreatment process, soak the silicon wafers in the flower basket into the cleaning tank, and perform ultrasonic overflow cleaning on the silicon wafers in the cleaning tank for 10-30 minutes to remove the dirt on the surface of the silicon wafers, and then use the cleaning solution to clean the silicon wafers. A hydrofluoric acid solution with a concentration of 2%-10% is used for cleaning to remove a slight oxide layer on the surface of the silicon wafer. Preferably, the concentration of the hydrofluoric acid solution is 5% to better activate the silicon atoms on the surface of the silicon wafer, and then Wash with pure water to remove the residual cleaning solution on the surface of the silicon wafer, that is, the hydrofluoric acid solution, so as t...

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PUM

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Abstract

The invention provides a process for nickel-silver plating of silicon wafers, including pretreatment: cleaning the surface of silicon wafers, activating atoms on the surface of silicon wafers; primary nickel plating: plating nickel on the surface of silicon wafers once; nickel sintering: combining the nickel layer and the silicon layer ; Secondary nickel plating: secondary nickel plating on the surface of silicon wafers; silver plating; silver plating on the surface of silicon wafers. The beneficial effects of the present invention are that secondary nickel plating can effectively increase the bonding force between the nickel layer and the silicon layer, silver plating can effectively prevent the oxidation of the nickel layer, and nickel-silver plating can make the bonding force between the silicon chip and the solder paste stronger. It is a silver plating solution, which is safer and more reliable in the process of production, transportation and storage, and saves production costs. The nickel silver plating process has the advantages of low production cost, high reliability, and long service life of silicon wafers.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer production, in particular to a process for nickel-silver plating of silicon wafers. Background technique [0002] In the production process of silicon wafers in the existing technology, it is necessary to plate gold on the surface of the nickel layer to prevent the oxidation of the lower nickel layer. The main component of the gold plating solution currently used is potassium gold cyanide, and the cost of potassium gold cyanide itself is relatively high And it is highly toxic, transportation and storage all need strict supervision procedures, which is not conducive to operation, and there is a great potential safety hazard at the same time. Contents of the invention [0003] The problem to be solved by the present invention is to provide a nickel-silver plating process for silicon wafers which prevents the oxidation of the nickel layer, is less harmful and has low cost. [0004] In order ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/34C23C18/42C23C18/18
CPCC23C18/1642C23C18/1692C23C18/1893C23C18/34C23C18/42
Inventor 梁效峰王彦君孙晨光徐长坡陈澄武卫王鹏杨玉聪韩义胜王浩尚杰丁成
Owner TIANJIN HUANXIN TECH DEV
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