The invention discloses a treatment method for
metal product falling on the back of a
wafer, which comprises the steps of
sheet film pasting,
metal deplating, cleaning,
drying,
grinding,
corrosion and re-
evaporation, and can be used again after
rework treatment of wafers which have
metal falling or have metal falling and cannot be used after
evaporation. In the treatment process, the
cracking rate of thin film pasting can be effectively reduced through secondary film pasting; when the deplating liquid
medicine is used for removing
nickel and silver, no heat is released, the reaction degree is not violent, the operation is free of risks, the
nickel and silver can be removed in a whole batch, the metal layer removing operation efficiency is improved, the product quality is not influenced, and the problems that the metal deplating difficulty is large, the operation risk is large, deplating is not thorough, the back face is floating after deplating, and the deplating efficiency is low are solved; during secondary
grinding, only Z2 accurate
grinding is used, so that the thickness of the
wafer subjected to secondary grinding can be ensured to be within a required range standard, the problem that materials cannot be automatically taken due to warping of the
wafer is solved, and meanwhile, a series of problems that the back surface of the wafer is rough due to too small grinding amount and the like are solved.