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Covering-type copper-nickel-silver composite powder and preparation method thereof

A composite powder, copper-nickel-silver technology, applied in coatings and other directions, can solve problems such as industrial production limitations, complex preparation processes, raw material pollution, etc., and achieve the effects of good interface bonding, simple process and less pollution

Inactive Publication Date: 2013-01-16
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned preparation process is relatively complicated, and the pollution and loss of raw materials are serious during the process, so industrial production is greatly restricted

Method used

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  • Covering-type copper-nickel-silver composite powder and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Design the composition of wrapped copper-nickel-silver composite alloy powder according to the binary or multi-component phase diagram; 100g pure copper (electrolytic copper, purity 99.9wt.%), 400g pure nickel (purity 99.99wt.%), 500g pure Silver (purity: 99.99wt.%) is placed in an alumina crucible, and then the alumina crucible is placed in a vacuum induction furnace built into the atomization equipment (power supply voltage: 110V / 220VAC; power supply frequency: 50-60Hz; working Frequency: 150 ~ 250KHz), close the furnace door and then evacuate until the vacuum in the vacuum induction furnace reaches 1×10 -3 Pa, increase the current until the above three pure metals are completely melted to liquid, and the liquid composition of the obtained alloy is 10Cu-40Ni-50Ag (wt.%). Pour the molten alloy liquid (about 1kg) into the liquid receiving hopper, and blow it with argon flow at the moment the liquid flows into the atomization chamber, and the copper-nickel-silver alloy p...

Embodiment 2

[0017] Place 100g of pure copper (electrolytic copper, with a purity of 99.9wt.%), 500g of pure nickel (with a purity of 99.99wt.%), and 400g of pure silver (with a purity of 99.99wt.%) in an alumina crucible, according to the example Step operation described in 1, the copper-nickel-silver alloy powder of preparation gained, its cross-sectional structure diagram and figure 1 Similarly, it is a wrapped structure, the core is a copper-nickel alloy ((Cu,Ni)-rich) core, and the outer shell is a silver alloy (Ag-rich) shell.

Embodiment 3

[0019] Place 400g of pure copper (electrolytic copper, with a purity of 99.9wt.%), 400g of pure nickel (with a purity of 99.99wt.%), and 200g of pure silver (with a purity of 99.99wt.%) in an alumina crucible, according to the example Step operation described in 1, the copper-nickel-silver alloy powder of preparation gained, its cross-sectional structure diagram and figure 1 Similarly, it is a wrapped structure, the core is a copper-nickel alloy ((Cu,Ni)-rich) core, and the outer shell is a silver alloy (Ag-rich) shell.

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Abstract

The invention discloses covering-type copper-nickel-silver composite powder and a preparation method thereof, relating to composite powder. The covering-type copper-nickel-silver composite powder comprises an inner core and a shell, wherein the inner core is a copper-nickel alloy core; the shell is a sliver alloy shell; the covering-type copper-nickel-silver composite powder comprises the following components in percentage by mass: 10-40% of Cu, 40-50% of Ni and the balance of Ag. Copper, nickel and silver are molten in a smelting device in a vacuum induction furnace, molten alloy liquid is poured into a liquid receiving hopper, and inert gas is injected at the moment when liquid flows into an atomizing chamber to obtain the covering-type copper-nickel-silver composite powder. According to an atomization method powder preparation technology, the covering-type copper-nickel-silver composite powder is prepared in one time without any chemical compound technology, so that the prepared covering-type copper-nickel-silver composite powder has the advantages of simple technology, high efficiency, small pollution, high powder product quality, and favorable interface bonding, can become a replacer of silver powder in the conductive filler field, and dual requirements of mechanicalness and functionality can be satisfied.

Description

technical field [0001] The invention relates to a composite powder, in particular to an encapsulated copper-nickel-silver composite powder and a preparation method thereof. Background technique [0002] In microelectronics, electrical appliances, communications, modern electronic warfare, warships and nuclear submarines, in order to prevent external electromagnetic interference and prevent its own electromagnetic waves from radiating outward, effective shielding measures are required. At present, electromagnetic shielding conductive coatings are used to solve the electromagnetic wave interference and shielding problems of electronic products. Ultrafine silver powder (1. Yang Shifu, Zhu Ruxing, Shi Yuguang; Preparation and application of ultrafine functional silver powder [J]; Jiangsu Metallurgy; 2003, 31: 14-15; 2. Meng Shuyuan, Wu Haibin; Wu Songping; Preparation and application of silver powder Conductivity Research [J]; Electronic Components and Materials; 2004, 7: 35-40...

Claims

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Application Information

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IPC IPC(8): B22F1/02B22F9/08
Inventor 王翠萍刘兴军郁炎刘洪新施荣沛
Owner XIAMEN UNIV
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