A Production Process for Improving the Performance of Lead-free Soldering of Zinc White Copper Strip

A production process and technology of lead-free solder, which is applied in the field of zinc-nickel-nickel strip processing, can solve the problems of unstable performance of lead-free solder, low test pass rate, small tin pulling force, etc., to improve the performance of finished lead-free solder, improve Lead-free solder performance, effect of improvement of lead-free solder performance
CN103628008BActive Publication Date: 2016-04-06安徽鑫科铜业有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
安徽鑫科铜业有限公司
Publication Date
2016-04-06

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Abstract

The invention discloses a manufacturing technology for improving a Pb-free solder property of a packfong strip. The manufacturing technology of the packfong strip comprises the steps of casting, surface milling, rough rolling, edge cutting, intermediate annealing, degreasing and cleaning, intermediate rolling, intermediate annealing, degreasing and cleaning, finished product rolling, finished product annealing, stretch bending and straightening, finished product cleaning and itemizing and storing, the finished product rolling working rate is 30 to 45%, and the roller surface roughness Ra adopted in the finished product rolling is less than or equal to 0.1[mu]m and larger than or equal to 0.3 [mu]m; the annealing temperature of the finished product is set to be 425 to 535 DEG C, and heat preservation is performed for 7 to 12 hours at the temperature; the concentration of the finished product cleaning acid liquor is controlled to be 4 to 9%; all of the finished product rolling, the finished product annealing and the finished product acid liquor cleaning improve the Pb-free solder property of the packfong strip.
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Description

technical field

[0001] The invention relates to the technical field of zinc-nickel-nickel strip material processing, in particular to a processing technology for improving the performance of lead-free soldering of zinc-nickel-nickel strip material. Background technique

[0002] With the introduction of the concept of environmental protection, many electronic product manufacturers have canceled the lead soldering process of electronic connectors and changed it to lead-free soldering process, which puts forward extremely high requirements on the soldering performance of materials. The index of lead-free solder performance of zinc white copper strip was proposed in the domestic market in recent years, and its test conditions are as follows:

[0003] Solder ball temperature: 255°C;

[0004] Flux: 5#;

[0005] Breakthrough tension time (Tb): 0.6s;

[0006] F1: When soaking for 1 second, the force value should be greater than 0.27mN;

[0007] F2: When soaking for 5 seconds, th...

Claims

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