A Production Process for Improving the Performance of Lead-free Soldering of Zinc White Copper Strip
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 安徽鑫科铜业有限公司
- Publication Date
- 2016-04-06
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Abstract
Description
technical field
[0001] The invention relates to the technical field of zinc-nickel-nickel strip material processing, in particular to a processing technology for improving the performance of lead-free soldering of zinc-nickel-nickel strip material. Background technique
[0002] With the introduction of the concept of environmental protection, many electronic product manufacturers have canceled the lead soldering process of electronic connectors and changed it to lead-free soldering process, which puts forward extremely high requirements on the soldering performance of materials. The index of lead-free solder performance of zinc white copper strip was proposed in the domestic market in recent years, and its test conditions are as follows:
[0003] Solder ball temperature: 255°C;
[0004] Flux: 5#;
[0005] Breakthrough tension time (Tb): 0.6s;
[0006] F1: When soaking for 1 second, the force value should be greater than 0.27mN;
[0007] F2: When soaking for 5 seconds, th...