PCB mounting process

A PCB board and mounting technology, applied in the field of PCB board mounting technology, can solve the problems of poor thermal conductivity of tin, unfavorable overall heat dissipation of components, and difficulty in heat dissipation of components
CN110248494AActive Publication Date: 2019-09-17深圳市英创立电子有限公司
4 Cites 2 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
深圳市英创立电子有限公司
Publication Date
2019-09-17

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a PCB mounting process and belongs to the technical field of circuit boards, and the problem of the poor heat dissipation in a soldering place of a PCB in the prior art is solved. The mounting process comprises the steps of (S1) printing solder paste on an A side of the PCB and mounting components, (S2) allowing the PCB to pass a reflow oven and performing reflow soldering on the A side, (S3) printing solder paste on a B side of the PCB and mounting components, (S4) allowing the PCB to pass the reflow oven and performing reflow soldering on the B side, and (S5) performing blade coating of heat-conducting silicone grease on soldering parts of the A side and B side after the solder pastes on the A side and the B side of the PCB are cured, wherein the solder pastes comprise the following parts including, by weight, 80 to 92 parts of nickel silver and tin alloy powder, and scaling powder including heat dissipating particles, and the weight ratio of the nickel silver and tin alloy powder to the scaling powder is (8.5-9):1. According to the invention, the heat dissipation performance of the soldering place is improved by using the alloy powder and the heat dissipating particles with high thermal conductivity.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of circuit boards, in particular to a PCB board mounting process. Background technique

[0002] PCB board, also known as circuit board, printed circuit board, replaces the method of wiring by printing; PCB board miniaturizes, centralizes and simplifies complex wiring and circuits of electronic components. The PCB board includes a single-sided board with parts concentrated on one side, a double-sided board with parts distributed on both sides, and a multi-layer board that can increase the wiring area.

[0003] In the assembly of PCB boards, the most widely used technology and process is surface mount technology (SMT for short). Assembly technology. The SMT process sequence includes printing solder paste, bonding the column feet of the components to the solder paste to achieve component mounting, sending the mounted PCB board into the reflow furnace for reflow curing, cleaning, and testing; The reflow furna...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More