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Flexible polishing device

A technology of flexible polishing and elastic matrix, which is applied in the direction of grinding device, grinding/polishing equipment, and the wheel of the working part with flexible effect, which can solve the problems of short service life, scratched surface of workpiece, and easy agglomeration of abrasives, etc. , to achieve the effect of reducing scratches and damage, improving service life and ensuring processing quality

Pending Publication Date: 2019-02-12
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional fixed abrasive polishing is difficult to keep the height of the abrasive edge consistent, which is easy to cause scratches and surface damage to the workpiece
The abrasive movement track of free abrasive polishing is uncontrollable, the abrasive is easy to agglomerate, and the polishing efficiency is low
Semi-solid abrasive polishing is to use some flexible bonding agents to hold the abrasive grains. The abrasive grains have a retreat during the polishing process, which effectively reduces the scratches and damage on the surface, but the removal efficiency is still low.
[0004] In addition, in terms of the tools used in the above three polishing methods: the tools used in consolidated polishing lose their processing ability when the abrasive grains on the surface fall off; the polishing slurry used in free abrasive polishing cannot be recycled in most cases Reuse causes a lot of waste of abrasives; polishing tools used in semi-consolidated polishing generally do not have good mechanical strength, are easily damaged, and have a short service life

Method used

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Examples

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Embodiment 1

[0030] Such as figure 1 and 2 As shown, a flexible polishing device includes a bottom plate 1 and a plurality of polishing blocks 2 .

[0031] The bottom plate 1 is a circular disk with a diameter of 300mm and is made of iron, which is used for magnetic suction occasions and is convenient for installation;

[0032] A plurality of polishing blocks 2, whose cross-sectional shape is symmetrical L-shaped, comprising an elastic matrix 20 made of polyurethane sponge and a diamond 22 with a particle size of 40 μm uniformly attached to the elastic matrix 20 by epoxy resin 21;

[0033] The above-mentioned plurality of polishing blocks 2 are distributed on the surface of the above-mentioned bottom plate 1 in a number of concentric circular arrays, and the bisector 23 of the cross section of each polishing block 2 is the tangent line of the ring 10 where the polishing block 2 is located, and the polishing block 2 The quantity from the inner ring to the outer ring is an arithmetic seque...

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Abstract

The invention discloses a flexible polishing device which comprises a bottom plate and multiple polishing blocks. According to the problems appearing in grinding material control and the tool servicelife in three polishing manners in the prior art, the high-strength flexible polishing device is provided, good wear resistance is achieved, and certain flexibility is also achieved. Machining qualityis guaranteed, and meanwhile the service life of the polishing device can be greatly prolonged. In the flexible polishing device, due to the fact that substrates and binding agents have elasticity, grinding particles have certain deformability in the polishing process, scratches and damage of the polishing surface can be effectively reduced, and a better polishing effect is achieved. When the shapes of the polishing blocks of the flexible polishing device are in symmetric L shapes for polishing, the contact length during friction of falling grinding materials and crushed workpiece scraps withworkpieces can be reduced, and scratches on the surfaces of the workpieces can be reduced.

Description

technical field [0001] The invention belongs to the technical field of polishing tools, and in particular relates to a flexible polishing device. Background technique [0002] With the rapid development of science and technology in this century, more and more brittle materials have been applied, especially in the fields of semiconductors, ceramic substrates and stone materials. This kind of material has the characteristics of high hardness and high brittleness. In order to make the material reasonably and fully exhibit its excellent characteristics and be applied, it must rely on mature material processing and treatment methods. In the general processing process, the grinding and polishing process directly determines the final surface accuracy and surface quality of the processed workpiece. [0003] At present, according to the consolidation mode of abrasives, polishing can be divided into fixed abrasive polishing, free abrasive polishing and semi-consolidated abrasive pol...

Claims

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Application Information

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IPC IPC(8): B24D13/14B24D99/00B24D18/00
CPCB24D13/14B24D18/0009B24D99/005
Inventor 陆静肖平徐西鹏
Owner HUAQIAO UNIVERSITY
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