Coining mold for thin film

Abstract

The invention provides a coining mold for thin film. The coining mold comprises a coining piston and a coining lower mold in mutual coordination with the coining piston, wherein the coining lower moldis internally provided with a coining cavity used for placing the thin film to be coined, the inner side wall and the bottom end of the coining cavity are provided with a plurality of heating devices, the lower end of the coining piston is provided with a plurality of seal rings in a sleeved manner, in addition, the side wall of the coining lower mold is further provided with a medium input mouth, and the lower end of the side wall of the coining lower mold is further provided with a medium discharging mouth used for discharging a medium. The coining mold for the thin film is simple in structure and high in practicability, water or ethyl alcohol and other gases or liquids is taken as the medium, so that the situation that the coining piston makes contact with the thin film directly to cause the structure of the thin film to be damaged is avoided, and the thin film is heated through the heating devices, thus the thin film does not need to be heated through additional heating devices, the coining efficiency of the thin film is further improved, and in addition, the coining quality of the thin film is guaranteed through a pressure detection device.

Description

technical field [0001] The invention relates to the technical field of molds, in particular to an embossing mold for thin films. Background technique [0002] Transparent electrodes are widely used in electronic devices such as solar cells, touch screens, and organic light-emitting diodes (OLEDs). Transparent conductive film layer materials are mostly transparent conductive metal oxides such as conductive organic films, graphene conductive films, single-layer carbon nanotube grids and indium tin oxide (ITO). Among them, ITO has a square resistance of less than 100 / sq at a transmittance of more than 90%, and has excellent comprehensive properties of light transmission and conductivity, but its main disadvantages are high comprehensive cost and poor flexibility. Conductive organics are expensive and poorly stable, and most of them are used in laboratories, while graphene and single-layer carbon nanotubes are complicated to prepare and costly, which limits their further applic...

AI Technical Summary

Problems solved by technology

[0004] However, the existing stamping molds are complex in structure, difficult to operate, poor in practicability, and poor in stamping effect. During mechanical stamping, the upper mold of the mold needs to be in direct contact with the silver nanowires, or through some solid media such as steel plates, PET, etc. Thin film, etc. to conduct pressure, because the two overlapping silver nanowires have a higher thickness, the two silver nanowires can be squeezed and deformed to increase the contact area, reduce its resistance and surface roughness

However, because it needs to contact objects, it will inevitably take away the silver nanowires, resulting in the destruction of the structure of the film and affecting its electrical conductivity.

Images