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Ultrasonic sensor and method for manufacturing ultrasonic sensor

A manufacturing method and ultrasonic technology, applied in ultrasonic/sonic/infrasonic diagnosis, ultrasonic/sonic/infrasonic Permian technology, ultrasonic/sonic/infrasonic image/data processing, etc., can solve the problem of large thickness of ultrasonic sensor and unfavorable ultrasonic Sensor thinning and other issues, to achieve the effect of reducing thickness

Inactive Publication Date: 2019-02-15
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing ultrasonic sensors usually include a multi-layer structure such as a protective layer, a signal receiving layer, a substrate, a signal transmitting layer, and a soft layer, which make the thickness of the ultrasonic sensor relatively large, which is not conducive to the thinning of the ultrasonic sensor.

Method used

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  • Ultrasonic sensor and method for manufacturing ultrasonic sensor
  • Ultrasonic sensor and method for manufacturing ultrasonic sensor
  • Ultrasonic sensor and method for manufacturing ultrasonic sensor

Examples

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Embodiment Construction

[0032] In this embodiment, a wearable ultrasonic sensing device is used as an example for description, but it is not limited to the wearable ultrasonic sensing device. In other embodiments, the ultrasonic sensing device of the present invention may be any other suitable for the technical solution. type of ultrasonic sensing device. Specifically, the following will take a wearable ultrasonic sensing device as an example to illustrate specific embodiments of the ultrasonic sensing device of the present invention.

[0033] Please refer to figure 1 , figure 1 It is a three-dimensional schematic diagram of the ultrasonic sensing device 100 according to the first embodiment of the present invention. like figure 1 As shown, in this embodiment, the ultrasonic sensing device 100 is a wearable ultrasonic sensing device. The ultrasonic sensing device 100 includes an ultrasonic sensor 10. The ultrasonic sensor 10 can be used to monitor physiological parameters such as blood flow, bloo...

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PUM

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Abstract

The invention provides an ultrasonic sensor, which comprises a substrate and an ultrasonic sensing layer, wherein the substrate is used for supporting the ultrasonic sensing layer. The ultrasonic sensing layer comprises a piezoelectric layer and at least one electrode layer which are arranged in a stacked mode, and the ultrasonic sensing layer is used for sending and receiving ultrasonic signals.According to the ultrasonic sensor, the sending and receiving of ultrasonic signals are achieved by the same ultrasonic sensing layer without respectively arranging a signal sending layer and a signalreceiving layer, so the thickness of the ultrasonic sensor is reduced.

Description

technical field [0001] The invention relates to an ultrasonic sensor and a manufacturing method of the ultrasonic sensor. Background technique [0002] In contemporary society, people's own health awareness has generally improved. In addition to the high attention to work and rest, diet and exercise, regular physical examinations are also essential. Ultrasound examination uses ultra-high-frequency sound waves to pass through the human body, and different tissues reflect different degrees of sound waves. After collecting these reflected waves, the computer's precise calculation shows the structure of the body tissue for doctors to judge whether it is normal or abnormal. [0003] At present, ultrasonic sensors have been widely used in medical imaging equipment due to their advantages of small size, low price, and safety. However, the existing ultrasonic sensors usually include multilayer structures such as a protective layer, a signal receiving layer, a substrate, a signal tr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B8/00A61B8/06A61B8/02A61B8/08
CPCA61B8/02A61B8/06A61B8/0891A61B8/4483A61B8/4494
Inventor 迦文西
Owner INTERFACE TECH CHENGDU CO LTD
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