Ceramic chopping knife and its manufacturing method and application

Abstract

The invention relates to a ceramic riving knife and a manufacturing method and application thereof. The manufacturing method of the ceramic riving knife comprises the following steps that a semi-finished ceramic riving knife with the initial surface roughness being 10 nm or below is provided; the surface of the semi-finished ceramic riving knife is subjected to laser bombardment treatment, thus aplurality of grooves are formed in the semi-finished ceramic riving knife, the spacing between the adjacent grooves is 5 microns to 20 microns, and thus the ceramic riving knife is obtained, wherein the laser wavelength for laser bombardment treatment is 200 nm to 600 nm, and the bombardment time is 10 minutes to 240 minutes. Through the manufacturing method, the ceramic riving knife with the longservice life and the good welding effect can be obtained.

Description

technical field

[0001] The invention relates to the processing field of ceramic materials, in particular to a ceramic chopper and its manufacturing method and application. Background technique

[0002] The ceramic rivet is an axisymmetric ceramic tool with a vertical hole. Because of its advantages of high hardness, high wear resistance, high temperature resistance, chemical corrosion resistance, high surface finish and high dimensional accuracy, it is used in the field of semiconductor wire bonding welding. play an irreplaceable role. Wire bonding is the process of pasting the chip electrode face up on the package base, and connecting the chip electrode and the corresponding electrode on the lead frame with a wire by welding. The purpose of wire bonding is to electrically connect the chip with the external packaging frame to ensure the smooth transmission of electrical signals. The choice of metal wire will affect the welding quality, device reliability, etc. The ideal ma...

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