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A kind of motherboard system and server

A motherboard and sub-node technology, applied in instruments, machines/engines, non-variable-capacity pumps, etc., can solve problems such as motherboard component failure, server performance and stability impact, power shutdown, etc., to reduce hot air reflow and reduce hot air Crosstalk, the effect of enhancing airtightness

Active Publication Date: 2021-05-07
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Heat dissipation design is an important point in the design of dual-node servers. Poor heat dissipation will lead to the failure of components on the motherboard, and even cause the power to be shut down in severe cases, which will affect the performance and stability of the server.

Method used

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  • A kind of motherboard system and server
  • A kind of motherboard system and server
  • A kind of motherboard system and server

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Embodiment Construction

[0030] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0031] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0032] As described in the background technology, placing two computing nodes in a dual-node server achieves the performance of two servers and saves cabinet space, but heat dissipation design is a key point in the design of a dual-node server, and poor heat dissipation will lead to The failure of components on...

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PUM

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Abstract

The present invention provides a motherboard system and a server. The motherboard system includes a plurality of sub-nodes that independently calculate points, and these sub-nodes are arranged in sequence along one direction. The power supply is set at the end of the sub-nodes and located at two adjacent sub-nodes Between adjacent sub-nodes, an isolation air duct is provided and an isolation cover is provided on the power supply, the isolation cover has an air inlet and an air outlet, and the air inlet faces the port of the gap between the isolation air ducts. In this way, the space where the sub-nodes are located is separated by the isolation cover that isolates the air duct and the power supply, and the crosstalk of hot air between adjacent sub-nodes is greatly reduced, thereby greatly reducing the return flow of hot air between adjacent sub-nodes and improving the heat dissipation of the system performance.

Description

technical field [0001] The invention relates to the field of computer equipment, in particular to a motherboard system and a server. Background technique [0002] With the continuous development of computer technology, servers are developing in the direction of high density, low power consumption and high processing capacity, and the dual-node server technology has emerged for this purpose. [0003] The dual-node server is to place two computing nodes in one chassis, and each computing node operates independently, which improves the computing power of the server, realizes the performance of two servers, and saves cabinet space at the same time. Heat dissipation design is an important point in the design of a dual-node server. Poor heat dissipation will lead to failure of components on the motherboard, and in severe cases, it will even cause the power to be shut down, which will affect the performance and stability of the server. Contents of the invention [0004] In view ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20F04D27/00
CPCF04D27/004G06F1/183G06F1/20
Inventor 于光义
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD