A microchannel heat sink that generates helical flow

Abstract

The invention provides a micro-channel heat sink for generating spiral flow. The micro-channel heat sink comprises a silicon-based bottom plate, a heat sink and a cover plate, wherein the silicon-based bottom plate, the heat sink and the cover plate are sequentially bonded; a heat source is arranged below the silicon-based bottom plate; the heat sink is formed by bonding an upper substrate and a lower substrate; a flow dividing groove, a flow converging groove and a micro channel are formed in the upper substrate, and a groove is etched in the side wall of the micro channel; an inclined grooveis etched in the lower substrate, and is communicated with the groove in the side wall of the micro channel; an inlet and an outlet are formed in the cover plate; and a cooling working medium is guided from the inlet, flows into the micro channel after being divided through the flow dividing groove, is combined through the flow converging groove and is guided out of the outlet. According to the micro-channel heat sink, the flow structure is changed through each micro-channel inner side groove and the bottom groove, the spiral flow is generated, and the mixing and heat transfer of the cold andhot fluids are enhanced, so that the heat transfer efficiency of the micro-channel heat sink is improved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of microelectronic chips, and in particular relates to a microchannel heat sink for generating spiral flow. Background technique [0002] With the development of the electronics industry, the miniaturization and integration of electronic equipment are getting higher and higher, the heat dissipation power of electronic chips has doubled, and the heat flux density can reach 100 W / cm 2 Even higher, for which there is an urgent need for new and efficient heat exchange devices to ensure the safe operation of electronic equipment. The heat transfer performance of micro-channels can well meet the cooling requirements of integrated circuits, and micro-channel heat sinks can replace traditional heat exchange channels. In order to further improve the heat transfer capacity, it is necessary to optimize the microchannel parameters, channel layout, wall structure, etc. to improve the heat transfer pe...

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Problems solved by technology

[0003] In the macroscopic channel, a block with a certain angle to the flow direction is often set on the wall surface to facilitate heat transfer enhancement, but it will bring greater pressure loss

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