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Technology for removing high-voltage diode pin resin burrs

A high-voltage diode and resin burr technology is applied in the field of surface treatment of high-voltage diode electrode leads, which can solve the problems of time-consuming and labor-intensive, affecting product appearance and solderability, and high cost, and achieve the effect of ingenious conception, improved labor productivity, and fast work efficiency.

Inactive Publication Date: 2019-02-19
NANTONG GAOXIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the packaging process, there will be resin burrs left on the lead wires at the inlet of the plastic mold. This resin burr will affect the appearance and solderability of the product. Therefore, the high-voltage diode production project has a deburring process, and the surface of the lead wires is manually scraped with a scraper. Attached burrs, time-consuming and labor-intensive, high cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] A process for removing resin burrs from pins of high-voltage diodes, removing resin burrs from pins of semi-finished products of high-voltage diodes after compression molding, which includes the following steps:

[0018] (1) Process preparation

[0019] Prepare stainless steel baskets and stainless steel hooks; pour the post-cured high-voltage diodes into the stainless steel baskets; check whether the heater and cooling water fume hood of the deburring liquid tank device are normal; the SYD712 deburring model ZH-127 The heater temperature of the liquid tank device is set at 65°C±3°C, and the liquid temperature is measured once a day with a thermometer. It should be 65°C±3°C. Liquid level mark, the liquid level mark is 40L±5L, if it is insufficient, add SYD712 deburring liquid to the liquid level mark; confirm that there is no leakage in the drainage device and liquid tank; confirm that the air pressure is greater than 5.5Kg / cm2; confirm that the high pressure water gun ...

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PUM

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Abstract

The invention relates to a technology for removing high-voltage diode pin resin burrs, and pin resin burrs of a high-voltage diode semi-finished product obtained after compression molding are removed.The technology comprises the following steps that firstly, technology preparation is made; secondly, the resin burrs are removed; thirdly, cleaning is conducted; and fourthly, drying is conducted. The conception is ingenious, design is reasonable, a high-voltage diode is immersed through SYD712 deburring liquid, the burrs of a pin of the high-voltage diode are softened and peeled off, the deburring effect is good, the work efficiency is high, time and labor are saved, and each person can treat 50 production batches per shift. According to manual burr scraping, the production amount of each person is 1.2 batches per shift. The labor productivity is greatly improved.

Description

technical field [0001] The invention relates to a surface treatment technology for high-voltage diode electrode leads, in particular to a process for removing resin burrs from high-voltage diode leads. Background technique [0002] In order to ensure the appearance and solderability of the leads, the leads of high-voltage diodes are generally silver-plated on the surface of oxygen-free copper wires. After the silver-plated leads are assembled and sintered with the silicon block, after a series of cleaning treatments, the surface of the silicon block is coated with glue and passivated, and then molded and packaged with epoxy resin. During the packaging process, there will be resin burrs left on the lead wires located at the feed port of the plastic sealing mold. This resin burr will affect the appearance and solderability of the product. Therefore, the high-voltage diode production project has a deburring process, and the surface of the lead wires is manually scraped with a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C37/02
CPCB29C37/02
Inventor 陈许平
Owner NANTONG GAOXIN ELECTRONICS