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Polyimide precursor composition and method for producing polyimide film using the same

A technology of polyimide and composition, applied in the field of display devices, to achieve the effect of good transmittance and surface properties

Active Publication Date: 2019-02-26
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And, when the higher high-temperature process start temperature and high-temperature curing (cure) process and fast temperature rise rate are carried out with the furnace not completely cooled, due to the rapid volatilization of the solvent, defects will occur on the coated surface. In order to improve this problem, try Various methods

Method used

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  • Polyimide precursor composition and method for producing polyimide film using the same
  • Polyimide precursor composition and method for producing polyimide film using the same
  • Polyimide precursor composition and method for producing polyimide film using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] [Example 1] Preparation of polyimide precursor composition :

[0042] 21.62g ( After 0.2mol) of p-phenylenediamine (PPDA), 58.84g (0.2mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) was added to react, and the reaction was completed after stirring for 18 hours , thereby obtaining a composition containing 15 parts by weight of polyamic acid (polyimide precursor) with respect to 100 parts by weight of the mixed solvent. In order to confirm that polymerization proceeds smoothly and whether thin film formation is possible, the viscosity of the composition was measured using a Brookfield viscometer, and the obtained polyamic acid composition had a viscosity of 15400 cps.

Embodiment 2

[0043] [Example 2] Preparation of polyimide precursor composition :

[0044] The mixing ratio of 1-ethyl-2-pyrrolidone (NEP) and N,N-dimethylpropionamide (DMPA) was 3:7, except that, polyamic acid was obtained by the same method as in Example 1 (polyimide precursor) composition. The obtained polyamic acid composition had a viscosity of 14760 cps.

Embodiment 3

[0045] [Example 3] Preparation of polyimide precursor composition :

[0046] The mixing ratio of 1-ethyl-2-pyrrolidone (NEP) and N,N-dimethylpropionamide (DMPA) was 5:5, except that, polyamic acid was obtained by the same method as in Example 1 (polyimide precursor) composition. The obtained polyamic acid composition had a viscosity of 14000 cps.

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Abstract

The invention discloses a polyimide precursor composition and a method for producing polyimide film using the same, and a display device comprising the polyimide film, wherein the polyimide precursorcomposition includes: a mixed solvent comprising 1-ethyl-2-pyrrolidone and N,N-dimethylpropionamide; and polyamide acid or polyimide.

Description

technical field [0001] The present invention relates to a polyimide precursor composition and a method for preparing a polyimide film using the same, in more detail, to a polyimide precursor composition that can be used for the preparation of a flexible substrate, a polyimide A method for preparing an amine film and a display device comprising a polyimide film. Background technique [0002] Recently, demand for flat panel displays (Flat Panel Displays; FPDs) that can easily realize a large area and can be thinned and lightened is increasing. Such a flat panel display includes a liquid crystal display (Liquid Crystal Display; LCD), a plasma display panel (Plasma Display Panel; PDP), an organic light emitting display (Organic Light Emitting Display; OLED) and the like. However, conventional flat panel displays use glass substrates, so they are not flexible, and their applications and uses are limited. Therefore, as a next-generation display device, a flexible display device ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1007C08G73/1067C08J5/18C08J2379/08C08G73/1032C08L79/08C08K5/1515G02F1/133305G02F1/13338G06F3/041C08K5/18
Inventor 车荣哲朴势周安民石赵英云金东敏
Owner DONGJIN SEMICHEM CO LTD