Polyimide precursor composition and method for producing polyimide film using the same
A technology of polyimide and composition, applied in the field of display devices, to achieve the effect of good transmittance and surface properties
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Embodiment 1
[0041] [Example 1] Preparation of polyimide precursor composition :
[0042] 21.62g ( After 0.2mol) of p-phenylenediamine (PPDA), 58.84g (0.2mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) was added to react, and the reaction was completed after stirring for 18 hours , thereby obtaining a composition containing 15 parts by weight of polyamic acid (polyimide precursor) with respect to 100 parts by weight of the mixed solvent. In order to confirm that polymerization proceeds smoothly and whether thin film formation is possible, the viscosity of the composition was measured using a Brookfield viscometer, and the obtained polyamic acid composition had a viscosity of 15400 cps.
Embodiment 2
[0043] [Example 2] Preparation of polyimide precursor composition :
[0044] The mixing ratio of 1-ethyl-2-pyrrolidone (NEP) and N,N-dimethylpropionamide (DMPA) was 3:7, except that, polyamic acid was obtained by the same method as in Example 1 (polyimide precursor) composition. The obtained polyamic acid composition had a viscosity of 14760 cps.
Embodiment 3
[0045] [Example 3] Preparation of polyimide precursor composition :
[0046] The mixing ratio of 1-ethyl-2-pyrrolidone (NEP) and N,N-dimethylpropionamide (DMPA) was 5:5, except that, polyamic acid was obtained by the same method as in Example 1 (polyimide precursor) composition. The obtained polyamic acid composition had a viscosity of 14000 cps.
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