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Package Substrate And Manufacturing Method Thereof

A technology for encapsulating substrates and manufacturing methods, applied to chemical instruments and methods, packaging, wrapping paper, etc., can solve the problems of time-consuming cost, unsuitable for mass production, etc., and achieve the effect of reducing manufacturing costs and saving manufacturing process time

Active Publication Date: 2016-11-23
SUBTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the procedure of cutting by laser is quite time-consuming and requires high cost, which is not suitable for mass production

Method used

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  • Package Substrate And Manufacturing Method Thereof
  • Package Substrate And Manufacturing Method Thereof
  • Package Substrate And Manufacturing Method Thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] Figure 1A to Figure 1P A schematic cross-sectional view of a manufacturing method of a package substrate according to an embodiment of the present invention is shown. According to the manufacturing method of the packaging substrate of this embodiment, first, please refer to Figure 1C , forming the first substrate 100 . In detail, the steps of forming the first substrate 100, first, please refer to Figure 1A , providing a dielectric layer 110 , a first release layer 120 , a second release layer 130 and a copper layer 140 . Next, please refer to Figure 1B , press the dielectric layer 110, the first release layer 120, the second release layer 130 and the copper layer 140 by thermocompression, wherein the first release layer 120 and the second release layer 130 are respectively located on the dielectric The copper layer 140 is located on the first release layer 120 and covers the first release layer 120 and a part of the front surface of the dielectric layer 110 . S...

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PUM

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Abstract

The present invention discloses a package substrate and a manufacturing method thereof. The manufacturing method comprises that: a first base is formed; a plurality of metal bumps is formed on the first base by plating; a second base having an upper and an lower surfaces, a core dielectric layer, a first and a second copper foil layers and a plurality of containing cavities is provided; an adhesive layer is formed on walls of the containing cavities; the first and the second bases are laminated so that the metal bumps are disposed inside the containing cavities; afirst base is removed; a plurality of blind via holes extending from the upper surface to the metal bumps is formed; a conductive material layer is formed on the first and the second copper foil layers, wherein the conductive material layer fills the blind via holes so as to define a plurality of conductive through via holes; the conductive material layer is patterned to form a first and a second patterned metal layers.

Description

technical field [0001] The present invention relates to a substrate structure and a manufacturing method thereof, and in particular to a packaging substrate and a manufacturing method thereof. Background technique [0002] At present, the packaging substrates with embedded copper blocks are mostly cut by laser cutting, and the large copper plates are cut into small copper blocks for use. However, the procedure of cutting by laser is quite time-consuming and requires high cost, which is not suitable for mass production. Contents of the invention [0003] The object of the present invention is to provide a packaging substrate and a manufacturing method thereof, which can effectively reduce costs and save manufacturing process time. [0004] To achieve the above purpose, the method for manufacturing a packaging substrate of the present invention includes the following steps. A first substrate is formed. A plurality of metal bumps are formed on the first substrate by electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/498
CPCH01L21/4853H01L23/49816C25D5/022C25D5/12H01L2224/11462B32B37/02B32B38/06B32B2038/047B32B2311/12B32B2457/08H01L25/0655H01L2224/0401H01L2224/04042H01L2924/15313B32B37/12B65D65/40
Inventor 王金胜陈建铭
Owner SUBTRON TECH
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