Supporting-type packaging device and packaging assembly

Abstract

The invention provides a supporting-type packaging device and a packaging assembly. Besides a packaging body used for packaging a main conducting body of the packaging assembly, a main packaging bodyof the packaging device is provided with supporting bodies which protrude relative to the bottom surface of the packaging body, all the supporting bodies are located around the packaging body, an extraction electrode and the ends, away from the packaging bodies, of the supporting bodies are coplanar, and therefore, when an inductor is electrically connected with an external assembly, the packagingdevice is supported mainly through the supporting bodies of the main packaging body. Therefore, the packaging assembly including the supporting-type packaging device can save the space, damage to theextraction electrode is not easily caused, and therefore, the packaging assembly has high production yield and high reliability.

Description

technical field [0001] The present invention relates to the technical field of semi-semiconductor packaging, and more particularly, to a supportable packaging device and packaging assembly. Background technique [0002] In order to reduce the size of the power module, the prior art provides a figure 1 Inductor structure shown. Such as figure 1 The shown inductance includes a coil 1, a lead-out electrode 21, a lead-out electrode 22, and an induction magnet 3 electrically connected to the head and tail ends of the coil 1, wherein the coil 1 is enclosed in its interior by the induction magnet 3, and the lead-out electrodes 21 and 22 Lead out from two sides of the inductive magnet respectively, and extend to a certain distance along the corresponding side towards the bottom surface of the inductive magnet 3 , and then bend to form outer leads bonded to the packaging carrier. From this, it can be seen that in the figure 1 When the inductor shown is installed on the printed ci...

AI Technical Summary

Problems solved by technology

[0003] In the supportable packaged devices realized by the prior art such as the above-mentioned inductor, the lead-out electrodes are usually used as the supporting legs of the packaged device. However, the lead-out electrodes are usually very thin, so during the transportation and installation of this inductor, the lead-out electrodes are easy to Bending so that even with a lot of extra work in shipping and assembly, it may still affect the yield of the finished product

Not only that, after this supportable packaging component is applied to the power module, when the power module is shaken, the lead-out electrodes are easily denatured, which is likely to cause power failure

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