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Flexible temperature sensor and preparation process thereof

A temperature sensor and sensor technology, applied in the sensor field, can solve the problems of weak regional temperature and anti-static, difficult temperature sensor measurement, low temperature detection accuracy, etc., and achieve the effect of wide adjustment range

Inactive Publication Date: 2019-03-01
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the technical problem to be solved by the present invention is to provide a fully flexible sensor for temperature sensors in the prior art that are difficult to measure the regional temperature of a specific surface, weak anti-static, and low temperature detection accuracy in specific scenarios. , low cost, light weight and high sensitivity flexible temperature sensor

Method used

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  • Flexible temperature sensor and preparation process thereof
  • Flexible temperature sensor and preparation process thereof

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Embodiment Construction

[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] refer to figure 1 , showing a schematic structural view of the first embodiment of the flexible temperature sensor unit, including:

[0025] Flexible substrate 1: the flexible substrate material at the top and bottom of the sensor; used for the bearing of the entire flexible sensor element; the flexible substrate is natural rubber, polyurethane, silicone rubber, fluororubber and styrene-ethylene-butadiene- Materials such as styrene, styrene-butadiene-styrene or polyisobutylene polymers;

[0026] Electrostatic network layer 2: The electrostatic network layer located on the bottom base material is used to isolate external electric field interference;

[0027] Lower insulating layer 3: the lower insulating layer above the el...

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Abstract

The invention discloses a flexible temperature sensor and a preparation process thereof. The sensor comprises flexible substrate materials located at the topmost layer and the bottommost layer of thesensor; an electrostatic net located above the bottom substrate material; an insulating material located above the electrostatic net; an interdigital electrode located above the insulating material; anano temperature-sensitive material located above the electrode and in close contact with the electrode; an insulating layer material located above and in close contact with the nano-temperature sensitive material; an electrostatic net material located above the insulating layer material; and an insulating material located above the electrostatic met. The process prepares the flexible temperaturesensor on a flexible substrate by self-assembly technology, and can be applied to temperature monitoring of irregularly shaped objects. The flexible temperature sensor provided by the invention has good flexibility, a good anti-interference ability and low cost.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a flexible temperature sensor realized by self-assembly technology and a preparation process thereof. Background technique [0002] Temperature sensors are widely used in both industrial and personal use. For example, various temperature sensing technologies such as thermal resistance, thermocouple, and optical fiber have been greatly developed in various fields. However, these temperature sensors are generally large in size, and it is difficult to install and arrange the temperature monitoring of small objects; moreover, the above-mentioned temperature sensors are made of non-flexible materials with high hardness, which cannot be applied to the surface of three-dimensional objects and used to measure three-dimensional objects surface temperature and distribution. [0003] Moreover, the above-mentioned sensors have defects such as limited service life and complex structure, so ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/22B82Y15/00B82Y30/00B82Y40/00
CPCG01K7/22B82Y15/00B82Y30/00B82Y40/00
Inventor 潘小山刘芮彤梁圣法
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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