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Liquid cooling plate and optical fiber laser

A liquid-cooling plate and heat-dissipating substrate technology, applied in lasers, laser parts, laser parts and other directions, can solve the problems of complex manufacturing process, uneven heat dissipation, complex liquid-cooling plate manufacturing process, etc., and achieve uniform heat dissipation and manufacturing process. simple effect

Pending Publication Date: 2019-03-01
SHENZHEN JPT OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a liquid cold plate to solve the technical problems of complex manufacturing process and uneven heat dissipation in the prior art
[0005] The object of the present invention is also to provide a fiber laser, the fiber laser includes the above-mentioned liquid cooling plate, which is used to solve the technical problems of complex manufacturing process and uneven heat dissipation of the liquid cooling plate of the existing fiber laser

Method used

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  • Liquid cooling plate and optical fiber laser
  • Liquid cooling plate and optical fiber laser
  • Liquid cooling plate and optical fiber laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] figure 1 A schematic diagram of the first structure of the liquid cold plate provided by the embodiment of the present invention from a first perspective; figure 2 A schematic diagram of the second perspective of the first structure of the liquid cold plate provided by the embodiment of the present invention; image 3 The cross-sectional view of the liquid channel in the first structure of the liquid cold plate provided by the embodiment of the present invention.

[0037] like Figure 1 to Figure 3 As shown, a liquid cold plate is provided in this embodiment, the liquid cold plate includes a heat dissipation substrate 100, and a liquid flow channel 200 disposed inside the heat dissipation substrate 100;

[0038] The liquid channel 200 includes at least two main channels and a plurality of sub-channels 202; both ends of the plurality of sub-channels 202 are respectively communicated with at least two of the main channels;

[0039] The heat dissipation substrate 100 i...

Embodiment 2

[0061] Figure 4 It is a schematic diagram of the second structure of the liquid cold plate provided by the embodiment of the present invention. like Figure 4 As shown, the liquid cold plate provided in this embodiment is a further improvement on the liquid cold plate provided in the first embodiment, and the technical solution described in the first embodiment also belongs to this embodiment. The technical solution will not be described repeatedly.

[0062] Specifically, as Figure 4 As shown, a liquid cooling plate is provided in this embodiment, which differs from the structure in Embodiment 1 in that the cross-sectional area of ​​the multiple flow channels 202 is rectangular, rectangular or other irregular shapes.

[0063] In this embodiment, the heat dissipation substrate 100 adopts the method of extrusion molding after mold opening, and all the runners 202 are formed synchronously with the heat dissipation substrate 100 when they are re-extruded, so the runners 202 d...

Embodiment 3

[0065] This embodiment provides a fiber laser, and the fiber laser includes the liquid cooling plate in Embodiment 1 or Embodiment 2.

[0066] Specifically, in the liquid-cooled plate in this embodiment, the cross-sectional area of ​​the main channel is larger than that of the branch channel, and the main channel includes the water inlet main channel 201 and the water outlet main channel 203 . The components with serious heat generation in the optical laser are installed on the main water inlet channel 201 or the main water outlet channel 203, and the components with low heat generation are installed on the shunt channel 202. The size of is correspondingly set above the shunt channel 202 with different cross-sectional areas. The fiber laser provided in this embodiment adopts the liquid-cooled plate provided in Embodiment 1 or Embodiment 2. The liquid-cooled plate can be designed in a differentiated manner according to the heat generated by the internal heating components. The ...

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Abstract

The invention provides a liquid cooling plate and an optical fiber laser, and relates to the field of heat dissipation. The liquid cooling plate comprises a heat dissipation substrate and liquid runners arranged in the heat dissipation substrate, wherein the liquid runners include at least two main runners and a plurality of sub-runners; two ends of the plurality of sub-runners are independently communicated with at least two main runners; the heat dissipation substrate is provided with a water inlet, a water outlet and a plurality of runner formation holes; one of at least two main runners iscommunicated with the water inlet, and the other main runner of the two main runners is communicated with the water outlet; and the plurality of runner formation holes are sealed through sealing elements. The optical fiber laser comprises the above liquid cooling plate. By use of the liquid cooling plate and the optical fiber laser disclosed by the invention, the technical problems in the prior art that a manufacture technology is complex and heat dissipation is uneven are solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a liquid cooling plate and a fiber laser. Background technique [0002] Medium and high power fiber lasers usually adopt a water-cooled design. In the previous water-cooled plate design, one method is to embed copper tubes on the heat dissipation substrate, then fill the gap between the copper tube and the substrate with thermally conductive curing glue, and then mill flat to achieve water cooling. , the disadvantage of this method is that the manufacturing process is complicated and the cost is high; another commonly used method is to process the long longitudinal channels in the water-cooled plate by deep hole drilling or extrusion molding. The sealing welding method is used to ensure the sealing of the water channel at the joint of the water channel. The water channel after processing is connected in series in one direction. The disadvantage of this method is that it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/04H01S3/042
CPCH01S3/0407H01S3/042
Inventor 陈建飞张承志
Owner SHENZHEN JPT OPTO ELECTRONICS CO LTD
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