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Hole plate for printed circuit board, manufacturing method thereof, and printed circuit board

A technology for printed circuit boards and manufacturing methods, which is applied in the direction of printed circuits, printed circuit components, and the formation of electrical connections for printed components, and can solve problems such as reducing the utilization rate of printed circuit boards, reducing the number of electronic devices, and increasing distances , to achieve the effect of increasing the number, increasing the use area and reducing the distance

Inactive Publication Date: 2019-03-01
MOBVOI INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such a design will directly lead to an increase in the distance between the holes in two adjacent hole plates, which increases the distance between the holes arranged on the printed circuit board and reduces the reliability of the electronic devices arranged on the printed circuit board. quantity, which in turn reduces the PCB area used and the overall design utilization

Method used

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  • Hole plate for printed circuit board, manufacturing method thereof, and printed circuit board
  • Hole plate for printed circuit board, manufacturing method thereof, and printed circuit board

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Embodiment Construction

[0025] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0026] figure 1 A schematic structural view of the orifice plate according to the embodiment of the present invention is shown, wherein the orifice plate includes: a first plate body 1 and a second plate body 2 , and the first plate body 1 and the second plate body 2 are located on the same plane. The first disc body 1 has four sides, and a drill hole 3 is provided in the middle of the first disc body 1 . The second tray body 2 is...

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Abstract

Embodiments of the invention provide a hole plate for a printed circuit board. The hole plate comprises: a first plate body and second plate bodies. The first plate body and the second plate body areon a same plane, wherein the first plate body has four side surfaces, the middle position of the first plate body is provided with a drill hole. The second plate bodies are on two opposite side surfaces of the first plate body, and are closely connected with the first plate body. Embodiments of the invention also disclose a printed circuit board and a manufacturing method of the hole plate. Sincethe second plate bodies in the embodiment are just disposed on two sides of the first plate body, and the second plate bodies are not disposed around the first plate body as in the prior art, when theplurality of hole plates are arranged, the hole plates can be brought close to each other to reduce the distance between the hole plates as much as possible, thereby reducing the distance between holes arranged on the printed circuit board and increasing the number of electronic components disposed on the printed circuit board. Thus, use area of the printed circuit board and utilization rate of the entire design are improved.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to an orifice plate used for a printed circuit board, a manufacturing method thereof, and a printed circuit board. Background technique [0002] With the development of science and technology, people have higher and higher requirements for the integration of printed circuit boards, and the number of electronic devices arranged on the printed circuit boards is also increasing. In order to realize the wiring connection between the various conductive layers included in the electrical device, it is necessary to pre-arrange a plurality of different types of holes (for example, through holes and blind buried holes) and hole pads for the holes on the printed circuit board. [0003] However, the applicant found that the traditional orifice plates are usually set in a circular shape, and a certain distance needs to be reserved between each orifice plate so that the orifice plates ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/42
CPCH05K1/112H05K3/42
Inventor 周昱行
Owner MOBVOI INC