Wafer detection method
A detection method and wafer technology, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve the problems of slow speed, low efficiency, low accuracy, etc., to reduce delay and improve scanning efficiency , the effect of improving the accuracy
Inactive Publication Date: 2019-03-08
宁波润华全芯微电子设备有限公司
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Problems solved by technology
[0006] In view of the above-mentioned defects in the existing technology, the existing wafer placement status monitoring method has the problems of slow speed, low efficiency and low accuracy
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[0049] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention.
[0050] like figure 1 As shown, the detection device includes a manipulator 1, a sensor, an amplifier, and a controller; the sensor is arranged on the manipulator 1,
[0051] Manipulator 1 can move up and down along the Z axis, rotate along the T axis, and stretch along the A axis;
[0052] For the convenience of description, in this embodiment, the sensor is a laser sensor 2, the amplifier is a fiber amplifier, the rise of the manipulator 1 along the Z axis is defined as the rise of the Z axis, and the fall of the manipulator 1 along the Z axis is defined as the fall of the Z axis, and the rotation of the manipulator 1 T axis Defined as T-axis rotation, adjusting the Z...
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The invention discloses a wafer detection method, related to the technical field of semiconductors. The method comprises the following steps: firstly, a sensor moves to a scanning starting position; then, the sensor is turned on; the sensor moves to a scanning ending position, wherein position information of a wafer is latched in the process; then, the sensor is turned off; a controller calculatesout a state of the wafer in each slot in a wafer box according to the latched position information; and finally, the controller sends a calculation result to an upper computer. Compared with the prior art, in the method provided by the invention, the controller continuously receives on and off signals output by an optical fiber amplifier, then, latches the position information of the wafer according to upper and lower edges of waveforms, and calculates the state of placement of the wafer in the wafer box according to a special algorithm; since a continuous high-speed latching function is realized, a system is free from reading each time when one value is latched, delay caused by communication is reduced, and thus, the method provided by the invention can scan a complete wafer box quicklyonce time, efficiency of scanning is improved, and accuracy is also improved.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer inspection method. Background technique [0002] In semiconductor processing, it is often necessary to transfer wafers between various stations. Before transferring, it is necessary to detect the placement status of wafers in each slot in the cassette, and upload the detection results to the host computer; the host computer According to the placement status of the wafers in each slot in the cassette, combined with the process flow to schedule the pick-up and release of the robot. If the detection result is incorrect, it may result in failure to pick up the chip and the process cannot be carried out smoothly, or cause the collision of the chip and cause the wafer to be scrapped. However, there are many deficiencies in the existing detection method of the wafer placement state. [0003] For example, when latching the z-axis position information, every time a positio...
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CPCH01L22/12
Inventor 陈胜华洪钰韬戚文涛王伟
Owner 宁波润华全芯微电子设备有限公司