A display motherboard and its preparation method and display substrate

Abstract

The invention provides a display motherboard, a preparation method thereof, and a display substrate. The display motherboard includes a plurality of sub-substrate areas, adjacent sub-substrate areas are spaced apart from each other, and a support structure is provided in the interval area between the adjacent sub-substrate areas, and the support structure can support the mask plate when depositing the film layer in the sub-substrate area. The display motherboard can prevent the middle area of ​​the mask plate from sagging under the action of gravity by setting a support structure, thereby reducing the distance difference between the middle area and the edge area of ​​the mask plate and the surface of the substrate in the sub-substrate area, thereby ensuring that the sub-substrate area The narrow border of the inner substrate; it can also avoid the damage to the substrate caused by partial contact between the mask plate and the substrate surface in the sub-substrate area; it can also relatively reduce the distance between the edge of the substrate in the sub-substrate area and the display area in the middle of the substrate before the protective film is finally pasted. The height difference is used to prevent the pressing force of the subsequent lamination of the protective film from causing damage to the film layer on the surface of the substrate by particle dirt, thereby ensuring the quality of the display motherboard.

Description

technical field [0001] The present invention relates to the field of display technology, in particular, to a display motherboard, a preparation method thereof, and a display substrate. Background technique [0002] In the process of producing OLED substrates, in order to improve production efficiency, usually a plurality of OLED sub-substrates are prepared simultaneously through one master board. Due to the large size of the OLED motherboard, the middle area of ​​the mask sheet (MASK Sheet) used in the preparation process will be closer to the substrate under the action of gravity, while the edge area will be farther away from the substrate, resulting in the production of OLED products. The wide packaging gap at the edge is not conducive to the narrow frame of OLED products; at the same time, the middle area of ​​the mask plate sags under the action of gravity, and if it comes into contact with the substrate, it will cause damage to the substrate. [0003] In addition, duri...

AI Technical Summary

Problems solved by technology

Due to the large size of the OLED motherboard, the middle area of ​​the mask sheet (MASK Sheet) used in the preparation process will be closer to the substrate under the action of gravity, while the edge area will be farther away from the substrate, resulting in the production of OLED products. The packaging gap width at the edge is large, which is not conducive to the narrow frame of OLED products; at the same time, the middle area of ​​the mask plate sags under the action of gravity, and if it comes into contact with the substrate, it will cause damage to the substrate

[0003] In addition, during the preparation process of the OLED substrate, only the area encapsulated by the inorganic encapsulation film on the edge of the OLED substrate is prone to fall particle dirt. Since the height of the edge of the OLED substrate is about 10 μm different from the height of the display area, and the inorganic encapsulation film is brittle, the particle dirt Under the pressing action of the subsequent bonding of the protective film, the inorganic packaging film is easily broken, so that water and oxygen penetrate into the light-emitting functional layer, which eventually leads to poor OLED substrates.

Images