Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Target fuel generator and method of supplying target fuel

A generator and fuel technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., to achieve the effect of improving product yield and increasing the number of products

Active Publication Date: 2021-01-22
TAIWAN SEMICON MFG CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] While existing photolithography techniques are often adequate for their intended purposes, they are still not fully satisfactory in all respects.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Target fuel generator and method of supplying target fuel
  • Target fuel generator and method of supplying target fuel
  • Target fuel generator and method of supplying target fuel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0077]The following disclosure provides many different embodiments or examples to implement different features of the present invention. The following disclosure of this specification is a specific example describing each component and its arrangement in order to simplify the description of the invention. Of course, these specific examples are not intended to limit the present invention. For example, if the following disclosure of this specification describes forming a first feature on or above a second feature, it means that it includes an embodiment in which the formed first feature and the second feature are in direct contact It also includes embodiments in which additional features can be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, different examples in the description of the present invention may use repeated reference symbols and / or words. These repeated symbols or words ar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Part embodiments of the invention provide a target fuel generator and a method for supplying a target fuel. The target fuel generator includes a storage assembly and a nozzle assembly. The storage assembly has a flow channel. The target fuel generator also includes a nozzle assembly. The nozzle assembly is connected to the storage assembly in a manner that the nozzle assembly can be rotated to a first rotation angle and a second rotation angle; and the nozzle assembly includes a first nozzle head and a second nozzle head. In a first rotational position, the first nozzle head is connected to the flow channel and the second nozzle head is separated from the flow channel; and in a second rotational position, the second nozzle head is connected to the flow channel and the first nozzle head isseparated from the flow channel.

Description

Technical field[0001]The embodiment of the present invention relates to a target fuel generator for supplying a target fuel to generate a radiation beam in a semiconductor wafer production equipment and a method for supplying a target fuel.Background technique[0002]The semiconductor integrated circuit industry has gone through a period of vigorous development. Advances in integrated circuit fuel and design technology have made each generation of integrated circuits smaller and more complex than previously produced integrated circuits. In the course of the development of integrated circuits, functional density (for example: the number of connected devices in each chip area) has generally increased, while geometric dimensions (for example: the smallest component (or circuit) that can be created in the manufacturing process) It is generally down. This process of miniaturization can often provide many benefits by increasing production efficiency and reducing related expenditures.[0003]H...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/6708H01L21/67253
Inventor 钟仁阳谢劼简上杰陈立锐郑博中
Owner TAIWAN SEMICON MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products