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Camera component and assembling method as well as terminal

A camera assembly and assembly method technology, applied in installation, optical components, image communication, etc., can solve the problems affecting the size and volume of the camera module, and achieve the effect of reducing height, realizing electrical connection, and improving electrical connection.

Inactive Publication Date: 2019-03-12
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The traditional PCB has a large volume, and the volume of the PCB will directly affect the volume of the camera module

Method used

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  • Camera component and assembling method as well as terminal
  • Camera component and assembling method as well as terminal
  • Camera component and assembling method as well as terminal

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Experimental program
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Embodiment Construction

[0044] The technical solution in this application will be described below with reference to the accompanying drawings.

[0045]It should be understood that the type of terminal equipment mentioned in the embodiment of the present application is not specifically limited, and the terminal equipment may include but not limited to mobile station (mobile station, MS), mobile phone (mobile telephone), user equipment (user equipment, UE), mobile phone (handset), portable equipment (portable equipment), cellular phone, cordless phone, session initiation protocol (session initiation protocol, SIP) phone, wireless local loop (wireless local loop, WLL) station, personal digital processing (personal digital assistant, PDA), radio frequency identification (radio frequency identification, RFID) terminal equipment for logistics, handheld devices with wireless communication functions, computing devices or other devices connected to wireless modems, vehicle-mounted devices, wearable devices, In...

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Abstract

The invention provides a camera component and an assembling method. The method comprises the following steps: plastically packaging a surface mount electronic element and an image sensor to form a target plastic package module, wherein the target plastic package module comprises an active surface, and a welding end of the surface mount electronic element and a welding end of the image sensor are respectively exposed on the active surface; and preparing a redistribution layer (RDL), performing drilling processing on the RDL to form a through hole, wherein the RDL comprises a dielectric layer and a metal wiring arranged in the dielectric layer, and enabling the metal wiring exposed on a first surface of the RDL and a welding end on the active surface of the target plastic package module to be connected together. The technical scheme provided by the embodiment of the invention can realize electrical connection of the electronic element by virtue of the metal wiring in the RDL, so that height of a camera module is reduced on the whole.

Description

technical field [0001] The present application relates to the technical field of semiconductors, and more specifically, to a camera assembly, an assembly method, and a terminal. Background technique [0002] As the design of the current mobile phone tends to be miniaturized and ultra-thin, the camera module, as an important module component of the mobile phone, is also facing the challenge of miniaturization and ultra-thin. Especially in the current high screen-to-body ratio and full-screen design, there is a stronger demand for the reduction in the size of the camera module. [0003] The structure of the existing camera module includes: printed circuit board (printed circuit board, PCB), soldering process, gold wire bonding process and so on. The traditional PCB has a large volume, and the volume of the PCB will directly affect the volume of the camera module. [0004] Therefore, how to reduce the height of the camera module has become an urgent problem to be solved. Co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H04N5/225
CPCH01L27/14634H01L27/1469H04N23/50H04N23/57H04N23/55H04N23/54H01L27/14618G02B5/208G02B7/006G03B11/00
Inventor 曹曦冉坤卿湘勇
Owner HUAWEI TECH CO LTD
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