Method for representing internal stress of TATB-based PBX under force-heat effect
A technology of thermal action and internal stress, applied in the direction of applying stable tension/pressure to test material strength, using wave/particle radiation for material analysis, measuring devices, etc., can solve the problems of complex response mechanism and weak effect of polycrystalline system
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[0045] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0046] as attached figure 1 As shown, the present invention provides a method for characterizing TATB-based PBX internal stress under a force-thermal effect, comprising the steps of:
[0047] Carry out in-situ mechanical stress / thermal stress loading on PBX, use neutron diffraction technology to obtain the lattice lattice parameters of TATB crystal, and obtain the relationship between mechanical stress, temperature and TATB lattice lattice parameters;
[0048] At the same time, use internal microstructure characterization technology to obtain the mesostructure of PBX;
[0049] The inflection point of PBX performance is obtained through the relationship between mechanical stress, temperature and TATB lattice parameters and the mesostructure, and finally the response behavior law of TATB crystal inside PBX under the action of thermal-mechanical co...
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