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A Method for Controlling the Thickness of Ink in Line Corner of Board Surface

A technology of ink and board surface, which is applied in the field of controlling the ink thickness of the line corner of the board surface, can solve the problem of insufficient ink thickness, achieve the effects of reducing fluidity, controlling ink thickness and uniformity, and improving process capability

Active Publication Date: 2020-06-23
广东喜珍电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to control the cost, some circuit boards with a copper thickness between 1.5oz and 2oz are printed with a solder mask, and the ink thickness of the customer must be met, and its service life and insulation are required to be guaranteed during use. This method easily leads to the problem of insufficient ink thickness due to the flow of line corner oil, which puts forward high requirements for the existing technology

Method used

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  • A Method for Controlling the Thickness of Ink in Line Corner of Board Surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A method for controlling the ink thickness of line corners on a board, is characterized in that it comprises the following specific steps:

[0023] S1. Mesh adjustment selection, choose 39T mesh screen version before printing;

[0024] S2. To prepare solder resist ink, add anti-sag agent at 5 mil / kg on the basis of solder resist ink main agent, do not add diluent, add curing agent and main agent, stir evenly, and let stand for 25 minutes;

[0025] S3. For printing, the thickness of the ink can be controlled to be more than 8um in the line angle, which meets the IPC standard; stand still for 60 minutes, because the ink viscosity is too high, and the solder resist ink on the board after printing is easy to produce air bubbles, so it must be left still after printing;

[0026] S4. pre-baked, let stand;

[0027] S5. Exposure and development, exposure and development shall be carried out within 12 hours after pre-baking. The solder resist ink prepared by the present invent...

Embodiment 2

[0035] A method for controlling the ink thickness of line corners on a board, is characterized in that it comprises the following specific steps:

[0036] S1. Mesh adjustment selection, choose 36T mesh screen version before printing;

[0037] S2. To prepare the solder resist ink, on the basis of the solder resist ink main agent, add anti-sag agent at 3 mil / kg, do not add diluent, add curing agent and main agent, stir evenly, and let stand for 20 minutes;

[0038] S3. For printing, the thickness of the ink can be controlled to be more than 8um at the line angle, which meets the IPC standard; stand for 40 minutes, because the ink viscosity is too high, and the solder resist ink on the printed board is prone to bubbles, so it must be left standing after printing;

[0039] S4. pre-baked, let stand;

[0040] S5. Exposure and development. Exposure and development should be performed within 1 hour after pre-baking.

[0041] Further, in step S2, the viscosity of the solder resist in...

Embodiment 3

[0044] A method for controlling the ink thickness of line corners on a board, is characterized in that it comprises the following specific steps:

[0045] S1. Mesh adjustment selection, choose 43T mesh screen version before printing;

[0046] S2. To prepare the solder resist ink, on the basis of the main agent of the solder resist ink, add anti-sag agent at 8 mil / kg, do not add diluent, add the curing agent and the main agent, stir evenly, and let it stand for 30 minutes;

[0047] S3. For printing, the thickness of the ink can be controlled to be more than 8um in the line angle, which meets the IPC standard; stand still for 75 minutes, because the ink viscosity is high, and the solder resist ink on the board after printing is easy to produce air bubbles, so it must be left still after printing;

[0048] S4. pre-baked, let stand;

[0049] S5. Exposure and development, exposure and development shall be carried out within 10 hours after pre-baking.

[0050] Further, in step S2,...

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PUM

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Abstract

The invention provides a method for controlling thicknesses of ink at line angles of panel surfaces. The method comprises the following specific steps of: S1, mesh adjustment and selection: selectinga network screen with 36T-43T meshes before printing; S2, solder resist ink deployment: on the basis of a main component of solder resist ink, adding anti-vertical flow agent according to 3-8 mil / kg,not adding a thinner, adding a curing agent to be uniformly stirred with the main component, and carrying out standing for 20-30 minutes; S3, printing: controlling the thickness of the ink above a line angle of 8 microns, and carrying out standing for 40-75 minutes; S4, pre-baking and standing; and S5, exposure and development: carrying out exposure and development within 1-12 hours after the pre-baking. According to the method, the mesh number and tension of the network screen, the dosage of printing ink and the additive amount of a vertical flow agent before the printing, the baking time after the printing and the development time after the exposure are controlled, so that the production cost is reduced, the process ability is enhanced and requirements of customers can be better satisfied.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for controlling the ink thickness of line corners on a board surface. Background technique [0002] With the multi-functional development of electronic products, circuit boards are widely used in the fields of scientific and technological electronic products, and some circuit boards produced have higher and higher copper thickness and solder mask ink thickness to ensure the conductivity and insulation of products. Facilitate customer production and meet demand. In order to control the cost, some circuit boards with a copper thickness between 1.5oz and 2oz are printed with a solder mask, and the ink thickness of the customer must be met, and its service life and insulation are required to be guaranteed during use. This method easily leads to the problem of insufficient ink thickness due to the flow of line corner oil, which puts forward very ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06G03F7/16
CPCG03F7/16G03F7/168H05K3/06
Inventor 文国堂贺波蒋善刚
Owner 广东喜珍电路科技有限公司